detail specification

harmonized system of quality assessment for electronic components . integrated analogue switching circuits . blank detail specification.

Harmonized system of quality assessment for electronic components. Fusible link programmable read only memories. Blank detail specification.

harmonized system of quality assessment for electronic components programmable logic arrays . blank detail specification.

Harmonized system of quality assessment for electronic components. Blank detail specification. Single gate field-effect transistors.

Harmonized system of quality assessment for electronic components. Blank detail specification. Ambient rated rectifier diodes.

Electromechanical elementary relays of assessed quality - Part 11 : blank detail specification - Relays for industrial application.

Harmonized system of quality assessment for electronic components. Blank detail specification. Case rated rectifier diodes.

Blank Detail Specification for Class IVa Dispersion-Unshifted Single-Mode Optical Waveguide Fibers.

Harmonized system of quality assessment for electronic components. Blank detail specification. Disk seal power tubes.

Blank detail specification. Fixed fibre optic attenuators.

Mechanical structures for electronic equipment - Outdoors enclosures - Part 2-1 : detail specification - Dimensions for cabinets.

Please submit your quotes with DETAIL SPECIFICATION of the websites.

Mechanical structures for electronic equipment - Outdoor enclosures - Part 2-2 : detail specification - Dimensions for cases.

Quartz crystal controlled oscillators of assessed quality - Part 5-1 : Blank detail specification qualification approval.

Note : Please refer to attach for more detail specification and drawing.

Connectors for electronic equipment - Part 2-001 : circular connectors - Blank detail specification.

Piezoelectric filters of assessed quality - Part 4-1 : blank detail specification - Capability approval.

Radio frequency and coaxial cable assemblies - Part 3-1 : blank detail specification for semi-flexible coaxial cable assemblies.

Radio frequency and coaxial cable assemblies - Part 2-2 : blank detail specification for flexible coaxial cable assemblies.

Liquid crystal and solid-state display devices - Part 2-1 : passive matrix monochrome LCD modules - Blank detail specification.

Radio frequency and coaxial cable assemblies - Part 4-1 : blank detail specification for semi-rigid coaxial cable assemblies.

Detail specification : two-part connectors for printed board for high number of contacts with basic grid of 2, 54 mm on 3 or 4 rows.

Detail specification for a matched pair of germanium coaxial mixer diodes

Blank detail specification: Fibre optic branching devices - Type: Wavelength selective transmissive star for telecommunication application

Mechanical structures for electronic equipment - Outdoor enclosures - Detail specification - Dimensions for cabinets

Blank detail specification; optocoupler with phototransistor output, providing protection against electrical shock

Fixed Metalized Polyethylene-Terephthalate Film Dielectric Chip Capacitors for Direct Current - Encapsulated, Blank Detail Specification for

Mechanical structures for electronic equipment - Outdoor enclosures - Detail specification - Dimensions for cases

Quartz crystal controlled oscillators of assessed quality - Blank detail specification - Qualification approval

Blank detail specification: fixed capacitors with metallized polycarbonate film dielectric for direct current; capability approval

Blank detail specification: Quarz crystal controlled oscillators (Qualification approval)

Blank detail specification: aluminium electrolytic capacitors with non-solid electrolyte (capability approval)

Blank detail specification: directly heated negative temperature coefficient thermistors (beads in envelopes)

Blank detail specification: Passive filter units for electromagnetic interference suppression - Filters for which safety tests are required

Quartz crystal controlled oscillators of assessed quality - Blank detail specification - Capability approval

Film and hybrid integrated circuits - Customer information, product assessment level schedules and blank detail specification

Detail specification for circular rigid waveguide tubing - Standard wall thickness - General application category

Blank detail specification: Waveguide type dielectric resonators - Capability approval

Blank detail specification: directly heated negative temperature coefficient thermistors (disk type)

Blank detail specification: Fixed capacitors with metallized electrodes and polypropylene dielectric

Blank detail specification: directly heated negative temperature coefficient thermistors (beads in solid glass or vitreous enamel)

Specification for harmonized system of quality assessment for electronic components - Blank detail specification - Fixed precision resistors

Blank detail specification: Electromechanical all-or-nothing sealed relays for aggressive industrial application

Blank detail specification: directly heated negative temperature coefficient thermistors (rod type)

Varistors for use in electronic equipment - Blank detail specification for silicon carbide surge suppression varistors - Assessment level E

Harmonized system of quality assessment for electronic components - Capability detail specification: multilayer printed boards

Blank detail specification: Printed board assembly modular electronic units of assessed quality - Capability approval

Detail Specification for Fixed Metallized Polyethylene Terephthalate Film Dielectric DC Capacitors Axial Leaded

Microwave diodes and transistors - Microwave field effect transistors - Blank detail specification

Capability detail specification; Flexible printed boards without through connections

Blank detail specification: Pulsed magnetrons (excluding frequency agile magnetrons)

Electromechanical all-or-nothing relays - Blank detail specification - Relays for industrial application

Blank detail specification: fixed metallized polyethylene-terephthalate film dielectric d. c. capacitors

System of quality assessment - Capability detail specification - Flexible multilayer printed boards with through-connections

Specification for harmonized system of quality assessment for electronic components - Blank detail specification - Display storage tubes

Blank detail specification: Microwave modular eletronic units of assessed quality - Capability approval

Blank detail specification: Electromechanical all-or-nothing relays for enhanced industrial application

Detail specification: High density rectangular connectors, round removable crimp contacts

Harmonized system of quality assessment for electronic components - Blank detail specification: image converter and image intensifier tubes

Capability detail specification; flexible printed boards with through connections

Blank detail specification; Liquid crystal displays Monochrome LCDs without electronic circuit

Detail specification for fixed wirewound insulated precision resistors - Full assessment level

Blank detail specification: Bipolar transistors for switching applications

System of quality assessment - Capability detail specification - Flex-rigid multilayer printed boards with through-connections

Radio frequency and coaxial cable assemblies - Blank detail specification for flexible coaxial cable assemblies

Radio frequency and coaxial cable assemblies - Blank detail specification for semi-flexible coaxial cable assemblies

Radio frequency and coaxial cable assemblies - Detail specification for flexible coaxial cable assemblies

Detail specification for fixed polystyrene foil dielectric capacitors - Tubular insulated case, axial terminations - Full asessment level

Detail Specification for Cylindrical Battery Holders, Standard Profile, for use in Electronic Equipment

Blank detail specification: film and hybrid integrated circuits (capability approval)

System of quality assessment - Capability detail specification - Flex-rigid double-sided printed boards with through-connections

Liquid crystal and solid state display devices. Passive matrix monochrome LCD modules. Blank detail specification

Radio frequency and coaxial cable assemblies - Blank detail specification for semi-rigid coaxial cable assemblies

Harmonized system of quality assessment for electronic components; blank detail specification; fixed mica dielectric d. c. capacitors

Radio-frequency connectors - Single, multi-series, dual-language blank detail specification

Blank detail specification: Case-rated bipolar transistors for high frequency amplification

Blank detail specification: Case-rated bipolar transistors for low frequency amplification

Blank detail specification: manufacturers supplying custom built precision potentiometers with their scope of capability approval

Blank detail specification for bipolar transistors for switching applications

Sensitive Switches, Single Break Contacts, Miniature Size, Detail Specification for

System of quality assessment - Capability detail specification - Rigid multilayer printed boards

Blank detail specification for fixed insulated (unshielded) r. f. inductors at the full assessment level

Detail Specification for Burn-In Sockets for Chip Carrier Packages with Molded Carrier Rings for Use with Electronic Equipment

System of quality assessment - Capability detail specification - Rigid double-sided printed boards with plated-through holes

Blank Detail Specification for Burn-In Socket for Chip Carrier Packages with Molded Carrier Rings for Use in Electronic Equipment

Blank detail specification; digital standard cells under capability approval

Blank detail specification for case-rated bipolar transistors for low-frequency amplification

System of quality assessment - Capability detail specification - Rigid single-sided and double-sided printed boards with plain holes

Blank Detail Specification for Single-Mode Fiber Optic Branching Devices for Outside Plant Applications

Blank detail specification: Radio frequency coaxial connectors

Film and hybrid integrated circuits - Part 4: Customer information, product assessment level schedules and blank detail specification

Blank detail specification: Light emitting diodes and infrared emitting diodes for fibre optic system or sub-system

Chip Carrier Sockets for Plastic Quad Flat Packages for Use in Electronic Equipment, Blank Detail Specification for

Detail Specification for Decoupling Capacitor Dual-In-Line Package Sockets for Use in Electronic Equipment

Blank detail specification: lead-screw actuated and rotary preset potentiometers

Detail Specification for Non-Sensitive Pushbutton Switch Momentary Contact

Blank detail specification: current regulator and current reference diodes

Blank detail specification: Ambient rated photocouplers with phototransistor output

Adapter-Carrier Quad Flat Pack to Pin Grid Array Sockets for Use in Electronic Equipment, Blank Detail Specification for

Blank detail specification for unijunction transistors

Sensitive Switches, Single Break Contacts, Basic Size, Detail Specification for

Detail specification for silicon coaxial resistive switching diode

Detail specification for multi-contact two-part printed board electrical connectors

Blank detail specification for laser diode modules with pigtail for fibre optic systems and subsystems

Blank Detail Specification for Class IVa Dispersion-Unshifted Single-Mode Optical Fibers

Blank detail specification for current-regulator and current-reference diodes

Non-Sensitive Pushbutton Switch Single-Pole Contact, Detail Specification for

Blank detail specification for variable tuning capacitors type A fitted with integral preset capacitors type C in electronic equipments

detail specification for silicon voltage - regulator diodes

detail specification for silicon avalanche rectifier diodes

Detail specification for silicon microwave switching diode, rod mounted

Special Use Sensitive Switches of Certified Quality Blank Detail Specification for

Detail Specification for Class IVa Dispersion-Unshifted Single-Mode Optical Fibers

Nonmechanically Actuated Flexible Carrier Sockets for Pin Grid Array for Use in Electronic Equipment, Detail Specification for

Blank Detail Specification for Field-Portable Optical Microscopes

Blank Detail Specification for Burn-In Sockets Used with Ball Grid Array Devices for Use in Electronic Equipment

E Varistors for use in electronic equipment-Part 2: Blank detail specification for zinc oxide surge suppression varistors Assessment level E

Blank detail specification for variable capacitance diodes

F Fixed resistors for use in electronic equipment--Part 5: Blank detail specification: Fixed precision resistors--Assessment level F

Blank detail specification: fixed ceramic capacitors of dielectric class 1, for electrical shock hazard protection

Blank Detail Specification for Field Portable Optical Fiber Stripping Tools

Blank Detail Specification for Decoupling Capacitor Dual-in-Line Package Sockets

detail specification for multiplayer chip inductors

Detail Specification on Dual-In-Line Package Switches, Raised and Recessed Slide-Actuated

Blank Detail Specification for Field-Portable Polishing Devices

Blank detail specification for semiconductor laser diodes

Blank Detail Specification for Field Portable Optical Fiber Cleaving Tools

Blank detail specification for continuous wave magnetrons

Blank Detail Specification for Special-Use Rotary Switches of Certified Quality

Detail Specification for Multi-Package 100 Mil Pitch, Vertical Mounting Format Module Sockets for Use in Electronic Equipment

Dual-In-Line Package Sockets for Use in Electronic Equipment, Blank Detail Specification for

Blank detail specification for chip fixed inductors for use in electronic equipment

Blank detail specification for silicon dual-gate field-effect transistors

Blank detail specification: fixed capacitors of ceramic dielectric, class 2; assessment level P (Telecom level)

Blank detail specification: fixed ceramic dielectric capacitors of barrier layer type (dielectric class 3)

Detail specification for ordinary rectangular (2: 1) rigid waveguide tubing - Standard wall thickness - General application category

Blank detail specification- Relays sockets of assessed quality

Detail Specification for Multi-Package 50 Mil Pitch, Vertical Mounting Format Module Sockets for Use in Electronic Equipment

Stepping motor for air conditioning detail specification

Detail Specification for Coin Cell Battery Holders for Use in Electronic Equipment

Detail Specification for Multi-Package 100 Mil Pitch, Angled Mounting Format Module Sockets for Use in Electronic Equipment

Blank detail specification for microwave detectors and mixer diodes

Blank Detail Specification for Class Ia Graded-Index Multimode Optical Fibers

Blank detail specification for thyratrons and gas-filled rectifier tubes

Blank detail specification: Fixed tantalum capacitors with non-solid electrolyte, porous anode (sub-family 2)

Detail specification for medium flat rectangular (4: 1) rigid waveguide tubing - Standard wall thickness - General application category

blank detail specification for monochrome display tubes

Detail specification for germanium coaxial mixer diodes

Blank detail specification: fixed mica dielectric d. c. capacitors

Blank Detail Specification for Class IVd Nonzero Dispersion Single Mode Optical Fibers for the 1550 nm Window

Detail Specification for Rotary Switches of Certified Quality (Low Current Rating) 16 Positions Maximum

fibre optic terminus sets - blank detail specification

Blank detail specification for variable trimmer capacitors type B in electronic equipments

Brushless D. C blower for air conditioning detail specification

Detail specification as in Russia export standard

Blank detail specification for variable tuning capacitors type A in electronic equipments

Blank detail specification for variable preset capacitors type C in electronic equipments

blank detail specification for pulse modulator tubes

detail specification for dual - in - line package sockets

Blank detail specification for receiving tubes

Blank detail specification for reverse blocking triode thyristors, ambient or case-rated, above 100 A

Blank detail specification for LED numeric displays

Blank detail specification for AC plasma display devices

Detail Specification for Short Stroke Keypads

Detail specification for coaxial mixer diodes

Detail specification: Rectangular connectors - Flat contacts, 0, 8 mm thickness, locking screw not detachable

Blank detail specification: fixed capacitors of ceramic dielectric, class 1

Blank Detail Specification for Round Style Sockets

Detail Specification for Round Style Sockets

Blank Detail Specification on Relay Sockets

Blank detail specification for disk seal power tubes

Blank detail specification for gunn diodes

detail specification for gas - filled microwave switching tubes of type rx - 277

Detail specification for flat rectangular (8. 33: 1) rigid waveguide tubing - Standard wall thickness - General application category

Detail Specification for Dual-In-Line Switches

detail specification for travelling wave tube of type bm - 1948

Aircraft; terminal junction systems; part 4: detail specification for type 2 system

Aircraft; terminal junction systems; part 5: detail specification for type 3 system

Detail Specification for Dual-in-Line 2-Piece Contact Socket for Use in Electronic Equpiment

Fibre optic fan-outs - Blank detail specification - Environmental categories 1, 2, 3, 5 and 99