| 单词 | wire bonding |
| 释义 | 例句释义: 引线拼命法,引线接合,打线,引线键合,焊线 1. Twisted-pair were in the wire bonding method sometimes used for coaxial cable, the method can make it smaller, lighter, cheaper. 在双绞线中黏合导线的方法有时也用于同轴电缆，这种方法能使其更小、更轻、更便宜。 blog.sina.com.cn 2. Wire bonding today is used throughout the microelectronics industry as a means of interconnecting the chips, substrates and output pins. 引线键合技术是现代微电子封装中常用的一种技术。 www.fabiao.net 3. Wire-bonding is one of the critical processes that determine the quality of IC packaging. 积体电路封装品质的良窳，焊线是一关键制程。 www.ceps.com.tw 4. Another focus was on how the operating parameters affect the ultrasonic wire bonding. 分析了各工作参数对超声波线焊产生的影响。 www.magsci.org 5. In ultrasonic wire bonding process, the bonding pressure is one of the most important factors to the bonding strength. 在超声引线键合过程中，键合压力是影响键合强度的重要因素之一。 www.dictall.com 6. The cost of wire bonding chips and solder bumped flip chips on boards or on organic substrates is stated. 文章讨论了引线键合芯片与板上或有机基板上焊料凸点式倒装片的成本比较问题。 www.dictall.com 7. Finally, wire bonding technics in the retral packaging of Schottky power diodes is optimized by orthogonal experiment design. 最后用正交试验的方法对肖特基器件后部封装中的压焊工艺进行了参数优化设计。 dict.kekenet.com 8. It has two gold wire bonding pads for electrical connections to the device. 有两个金黄色的线路焊接点，用于设备的电路连接。 www.e-gtm.com.cn 9. This paper summarizes the application of the fuzzy evalution on gold wire-bonding process optimization. 概述了模糊判别法用于提高金丝键合拉力强度的工艺优化状况。 www.ceps.com.tw 10. Through the silicon bonding, we achieve a wafer-level vacuum package, and the wire-bonding PAD is made after the fabrication is complete. 在完成整体结构圆片级真空封装的同时，通过引线腔结构方便地实现了中间电极的引线。 www.dictall.com 1. Improving yield of wire bonding ? 提高焊线质量 wenku.baidu.com 2. Current Status and Prospects of Studies on High Acceleration and High Precision Positioning Stage used in Wire Bonding Machine 引线键合机中高加速度高精度定位平台的研究现状与展望 www.ilib.cn 3. Studies of the Characteristic of Ultrasonic Complex Transverse Vibration Energy Transmission in Wire Bonding 引线键合机中复杂超声能量传递特性研究 www.ilib.cn 4. Studies on the Characteristic of Ultrasonic Complex Transverse Vibration Energy Transmission in Wire Bonding 引线键合中多向超声能量传输特性研究 ilib.cn 5. Illumination System Modeling Techniques in Wire Bonding Pattern Recognition System 引线键合图形识别系统中的照明系统模拟技术 www.ilib.cn 6. Study on characteristics of complex transverse ultrasonic energy transmission in wire bonding 引线键合中多向超声波能量传输特性研究 ilib.cn 7. A novel instrument of silicon chip thermocompression outer wire bonding and jointing process research 硅芯片外引线键合的热压焊装置及焊接工艺 www.ilib.cn 8. Transient Temperature Property of Ultrasonic Wire Bonding Process 超声引线键合过程的瞬态温度特性 www.ilib.cn 9. Experimental Studies of Bonding Pressure on Heavy Aluminum Wire Bonding Strength 键合压力对粗铝丝引线键合强度的实验研究 www.ilib.cn 10. Two-dimensional Contact Finite Element Analysis of Ultrasonic Wire Bonding 超声波线焊的两维非接触有限元分析 www.ilib.cn 1. Wire Bonding for IC Technology Materials Failure Mechanism and Reliability 集成电路内引线键合工艺材料失效机制及可靠性 www.ilib.cn 2. Development of Control System Used in Ultrasonic Al Wire Bonding Machine 超声波铝线自动邦定机控制系统的研制 www.ilib.cn 3. Automatic encapsulating Auto-wire bonding machine 自动分光机 sunlight-led.com 4. Plasma Considerations Prior to Wire Bonding in Advanced Packaging 先进封装中引线键合前等离子处理 www.ilib.cn 5. Reliability and Its Practical Using of Al wire Bonding 铝线邦定的可靠性及其应用 www.ilib.cn 6. A PZT driver signal acquisition and analysis system for ultrasonic wire bonding 超声引线键合PZT驱动信号采集分析系统 www.ilib.cn 7. Review of Ultrasonic Wire Bonding Mechanism in Chip Interconnection 芯片互连超声键合技术连接机制探讨 www.ilib.cn 8. A Novel Instrument of Thermocompression Wire Bonding 一种硅芯片外引线键合的热压焊简易装置 www.ilib.cn 9. The Optimization Design of Wire Bonding Force Control System 引线键合力控制系统的优化设计 www.ilib.cn 10. Wire Bonding Reliability for Light Emitting Diode 发光二极管引线键合可靠性探讨 www.ilib.cn 1. Analysis on the Effect of Wire Bonding Process Parameters on the Packaging Quality 引线键合工艺参数对封装质量的影响因素分析 www.ilib.cn 2. Large-Diameter Al Wire Bonding to Thick-Film Conductors 厚膜导带上的粗丝键合 168.160.184.78 3. Wire Bonding Technology in IC Packaging 集成电路封装中的引线键合技术 www.ilib.cn 4. The Design of Wire Bonding Based on Permanent Magnet Linear Motor 基于永磁直线电机引线键合系统的设计 www.ilib.cn |
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