| 单词 | multi-chip | ||||||||
| 释义 | multi-chip
更多释义 收起释义 例句释义: 多片,可设计多芯片,多晶粒 1. Mask line Machining made of non-woven using high-quality, single and multi-chip packaging, and customers can request for sterilization. 面膜系采用优质无纺布加工制成，有单片和多片包装，并可按客户要求作灭菌处理。 wenda.tianya.cn 2. Now, 3D multi-chip packages are the next phase for its future use in advanced PCB manufacturing process. 目前，3D多芯片堆叠组装正在成为未来先进印刷电路板制造工艺的发展方向。 www.qikan.com.cn 3. Multi-chip CCD butting is an important approach in implementation of optical instruments with wide field of view and accurate precision. 在研制大视场、高精度光电测量设备过程中，采用多块CCD拼接技术是重要手段之一。 www.dictall.com 4. Besides, the invention provides a manufacturing method for the multi-chip packaging structure. 此外，一种多芯片封装结构的制造方法亦被提出。 ip.com 5. In recent years a new class of distributed multi-chip neuromorphic systems have emerged, e. g. 近年来一个新的类神经系统的分布式multi-chip也应运而生，例句。 zhidao.baidu.com 6. By using multi-chip integrated circuit and image rejection mixer, a small 3-channel receiver front-end is designed. 采用多芯片混合集成电路和镜频抑制混频器技术，设计了一种小型化三通道高放混频接收前端。 www.dictall.com 7. Multi-chip coal, blended with blending together. 多方筹煤，通力合作配煤掺烧。 www.123wzdq.com.cn 8. The bright-LED models with single chip and multi-chip are built up. 文章还建立了白光LED的单芯片和多芯片组封装模型。 www.fabiao.net 9. Multi-Chip Packaging Technologies and its Applications 多芯片封装技术及其应用 www.ilib.cn 10. Time-domain Measurement and Calibration of Mismatch Errors in Multi-chip ADC Time-interleaved Systems 多片ADC并行采集系统的误差时域测量与校正 www.ilib.cn 1. Simulation on Vertical Via Interconnect Using Matrix-Penciled Moment Method in Multi-Chip Module 微波多芯片组件中垂直通孔互连的矩阵束矩量法仿真 www.ilib.cn 2. Transient Response of Multi-Chip Modules Interconnection 多芯片组件互连瞬态响应 www.wanfangdata.com.cn 3. Research progress in vertical via interconnect in microwave multi-chip module 微波多芯片组件中垂直通孔互连的研究进展 scholar.ilib.cn 4. Chip Stress Analysis and Structure Optimization in Stacked Multi-Chip Package 多芯片叠层封装中的芯片应力分析及结构优化 www.ilib.cn 5. Finite element simulation for three dimensional thermalanalysis of multi-chip module 多芯片组件的热三维有限元模拟与分析 www.ilib.cn 6. Study on the Techniques of Thermal Analysis for Multi-chip Modules 多芯片组件热分析技术研究 www.ilib.cn 7. The Study of Thermal Analysis of Multi-Chip Module by Thermal Resistor Network 利用热阻网络拓朴关系对多芯片组件热分析技术的研究 www.ilib.cn 8. Mathematical Model for Multi-chip-split Groove Drill 多分屑槽钻尖的数学模型 www.ilib.cn 9. Application of Multi-chip Module Technique 多芯片组件技术应用实例 service.ilib.cn 10. Microcomputer protection platform based on embedded multi-chip module 基于嵌入式多芯片模组的微机保护平台 www.ilib.cn |
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