The shear strength of BGA joint with eutecticsolder is higher than that of tin-lead alloy itself.
共晶钎料BGA球焊点的抗剪强度比锡铅合金钎料自身的抗剪强度大。
2
Choi S. Lee J. Guo F Creep properties of eutectic SnAg solder and Sn- Ag composite solders containing intermetallic particles.
史耀武。闫焉服。刘建萍金属颗粒增强的锡铅基复合钎料及其制备方法。
3
Using a co-electroplating process, it was possible to plate the Au–Sn solder directly onto a wafer at or near the eutectic composition from a single solution.