| 单词 | chemical mechanical polishing | ||||||||||||||||
| 释义 | chemical mechanical polishing
更多释义 收起释义 例句释义: 化学机械研磨,化学机械抛光,化学机械研磨制程 1. Diamond disk conditioners have long served the semiconductor chemical mechanical polishing (CMP) process for polish pad dressing. 钻石修整器应用于化学机械抛光中抛光垫的修整，已有很长的一段时间。 www.ceps.com.tw 2. A chemical mechanical polishing pad comprising a water-insoluble matrix which comprises (A) a styrene polymer and (B) a diene polymer. 一种化学机械抛光垫，包含由（A）苯乙烯聚合物和（B）二烯聚合物构成的非水溶性基质。 www.1168818.cn 3. The invention provides a chemical-mechanical polishing composition for polishing a substrate. 本发明提供用于抛光基板的化学机械抛光组合物。 ip.com 4. Embarked from the component and structure of phosphate laser glass, its chemical-mechanical polishing (CMP) mechanism is analyzed. 从磷酸盐激光玻璃的成分和结构出发，分析了其化学机械抛光（CMP）机制。 www.cnoptics.net 5. Applied Study of Electrochemistry Theory on the Copper Chemical-mechanical Polishing 铜化学机械抛光中电化学理论的应用研究 ilib.cn 6. Simulation for an Abrasive Particle of the Chemical Mechanical Polishing with AFM 基于AFM的化学机械抛光磨粒模拟研究 ilib.cn 7. Hydrodynamic Analysis of Chemical Mechanical Polishing with Circular Translational Moving 圆平动化学机械研抛过程的流体动力性能分析 ilib.cn 8. Study on Fixed-abrasive Chemical-mechanical Polishing Technology of Wafer in Integrate Circuit Manufacturing 集成电路制造中的固结磨料化学机械抛光技术研究 ilib.cn 9. Corrosive Wear Analysis of the Copper Chemical-mechanical Polishing in ULSI Manufacturing ULSI制造中铜化学机械抛光的腐蚀磨损机理分析 ilib.cn 10. Application and research of endpoint-detection technology for chemical mechanical polishing of large size wafer 大直径硅晶片化学机械抛光及其终点检测技术的研究与应用 www.ilib.cn 1. Recent Progress in Study on Material Removal Mechanisms of Silicon Wafer During Chemical Mechanical Polishing 半导体芯片化学机械抛光过程中材料去除机理研究进展 ilib.cn 2. Analysis of Influences on Within-wafer-nonuniformity of Motion Form in Wafer Chemical Mechanical Polishing 硅片化学机械抛光时运动形式对片内非均匀性的影响分析 ilib.cn 3. Application of Chemical Mechanical Polishing Technology on the Finish Machining 化学机械抛光技术在超精加工中的应用 ilib.cn 4. Research of Chemical Mechanical Polishing Technique of Sapphire Substrate 蓝宝石衬底的化学机械抛光技术的研究 service.ilib.cn 5. Research and Prospects on Copper Chemical Mechanical Polishing in ULSI Manufacturing ULSI制备中铜布线化学机械抛光技术的研究与展望 www.ilib.cn 6. Chemical Mechanical Polishing of Silica Dielectric in ULSI Manufacturing 介质的化学机械抛光 www.wanfangdata.com.cn 7. RBR control applied on chemical -mechanical polishing process in ULSI manufacturing RBR控制在超大规模集成电路制造的化学机械抛光工艺中的应用 www.ilib.cn 8. Galvanic Corrosion of TiN-W Electro-couple During Tungsten Chemical Mechanical Polishing 钨的化学机械抛光过程中TiN-W电偶的腐蚀行为 www.ilib.cn 9. A Chemical Mechanical Polishing Model Based on the Viscous Flow of the Amorphous Layer 一种基于非晶层粘性流动的机械化学抛光模型 ilib.cn 10. Recent Advancement of Chemical-Mechanical Polishing Technology of Metal 金属的化学-机械抛光技术研究进展 service.ilib.cn 1. Material Removal Mechanism and Model in Chemical Mechanical Polishing of Silicon Wafers 硅晶片化学机械抛光材料去除机制与模型 ilib.cn 2. Chemical Effect Mechanism in Chemical Mechanical Polishing for Silicon Wafer 硅晶片化学机械抛光中的化学作用机理 www.ilib.cn 3. Research on Surface Topography of Silicon Wafer in Chemical-mechanical Polishing 硅片化学机械抛光中表面形貌问题的研究 ilib.cn 4. Chemical Mechanical Polishing of Sapphire Substrate 蓝宝石衬底片化学机械抛光的研究 www.ilib.cn 5. Micro-Polar Effects of Flow Features of Slurries in Chemical Mechanical Polishing Process 化学机械抛光中抛光液流动的微极性分析 www.ilib.cn 6. Technology analysis of wafer chemical mechanical polishing in the manufacture of ULSI 超大规模集成电路制造中硅片化学机械抛光技术分析 www.ilib.cn 7. Analysis on Flow Properties of Chemical Mechanical Polishing Process 化学机械抛光流动性能分析 ilib.cn 8. Study on Chemical Mechanical Polishing Technology for CdSe Wafer for Detectors 探测器晶片化学机械抛光工艺研究 jtxb.cn 9. Study on the Chemical Mechanical Polishing of Large Diameter Lithium Niobate Wafer 大直径铌酸锂晶片的化学机械抛光研究 service.ilib.cn 10. Effects of nano-scale particles in chemical mechanical polishing process 化学机械抛光中纳米颗粒的作用分析 www.ilib.cn 1. Analysis and Research on Copper Chemical-mechanical Polishing 铜布线化学机械抛光技术分析 ilib.cn 2. Research on the planarity in the copper Chemical mechanical polishing process 铜化学机械抛光中的平坦性问题研究 www.ilib.cn 3. Chemical Mechanical Polishing for Silicon Wafer Planarization by Exerting Partial Region Load 单晶硅片的区域载荷法平坦化抛光 www.ilib.cn 4. Study on Abrasive Effect in Copper Chemical-Mechanical Polishing 磨料对铜化学机械抛光过程的影响研究 ilib.cn 5. Advances in Chemical Mechanical Polishing 化学机械抛光技术的研究进展 service.ilib.cn 6. Effect of Corrosion Inhibitor in the Chemical Mechanical Polishing of Copper 缓蚀剂在铜化学机械抛光过程中的作用研究 www.ilib.cn 7. Analysis on Pad Effects in Chemical Mechanical Polishing 化学机械抛光中抛光垫作用分析 www.ilib.cn 8. Modeling of Chemical Mechanical Polishing Material Removal Based on Molecular-Scale Mechanism 基于单分子层去除机理的芯片化学机械抛光材料去除模型 www.ilib.cn 9. Development of Chemical Mechanical Polishing Slurry 化学机械抛光液的研究进展 www.ilib.cn |
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