Actuality, theory, and property of plating processes on magnesium alloys were introduced, such as electroplating, chemistry plating and dryplating.
介绍了镁合金表面化学镀、电镀、干法镀等工艺的基本原理、工艺特点和国内外研究现状。
2
Current density: unit under the plating area under current, usually the higher current density film thickness is thicker, but is high coating will scorched thick dry.
电流密度：单位电镀面积下所承受的电流，通常电流密度越高膜厚越厚，但是过高时镀层会烧焦粗燥。
3
Dry-Film Developing: The unexposed areas of the dry-film are dissolved away. The dry-film creates a "channel"for copper pattern plating to take place.