The experimental results indicate that the designed parallel mechanism can meet the working requirements of the IC die bonder and each performance index has reached the design standards.
实验结果表明：所设计的机构能满足IC芯片粘片机的工作要求，各项性能指标均达到了设计标准。
2
The key issues in stamping die design using CBR, including case memory, case index and case retrieval are examined in this paper and a model for case based stamping die design is proposed.