Introduction to semiconductor manufacturing technology including oxidation, diffusion, alloying, re-flow process, copper process and chemical-mechanical polishing.
半导体制程技术包括氧化、扩散、热处理、合金化、再流动制程、铜制程及化学机械研磨制程简介。
2
The interfacial diffusion of alloying element is important to microstructure, microhardness and interfacial bonding strength.
合金元素在界面两侧的扩散是影响材料显微组织、显微硬度及界面结合强度的关键。
3
The interfacial diffusion of alloying element is an important factor to microstructure, apparent hardness and interfacial bond strength.