The next step up in size is the pad, something of a cross between a sheet of paper and current laptop and palmtop computers.
规模上而言，下一步是垫子，一种位于一张纸和当前膝上型和掌上型计算机之间的东西。
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Typical chemical mechanical polishing (CMP) of copper layers on semiconductor devices involves using a hard pad in the first step and a soft pad for the barrier layer removal step.
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