The dislocation etch pits density(EPD) of copper single wires is related with corroded time, deformative extent and crystalorientation of material.
铜单晶线材中位错蚀坑密度与材料浸蚀时间,变形量以及晶体学取向有关。
2
Test results show that the yield characteristics of DD3 singlecrystal depend on test temperature, strain rate, and orientation of samples.
试验发现,单晶DD3的屈服特性随温度、应变率、晶向而变化。
3
A method for manufacturing an ink-jet print head including: preparing a singlecrystal silicon wafer having a (110) crystal plane orientation, as a substrate;