Finally has carried on the study and realization to the change gear case CAD system hypothesized packagingtechnique.
最后对变速齿轮箱CAD系统中的虚拟装配技术进行了研究和实现。
2
Low Temperature Co fired Ceramics (LTCC) is an excellent packagingtechnique for achieving highly reliable and miniature microwave multichip modules (MMCM).
低温共烧陶瓷(LTCC)是实现小型化、高可靠微波多芯片组件(MMCM)的一种理想的组装技术。
3
Low Temperature Co-fired Ceramics (LTCC) is an excellent packagingtechnique for achieving highly reliable and miniature microwave multi-chip modules (MMCM).