The electric characteristic parameters of package for high speed ASIC include propagation delay, characteristic impedance, cross talk, parasitic inductance and capacitance.
高速ASIC封装的电性能参数包括传输延迟、特性阻抗、信号串扰以及封装电感和电容等。
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Reed relays are ideal for applications requiring low and stable contact resistance, low capacitance, high insulation resistance, long life and small package size.