Technics of LTCC MLB processing using thin filmcircuit technology, ink-jet printing, laser drilling, and conventional manufacturing methods is introduced.
概述了综合运用薄膜线路技术、喷墨打印技术和激光钻孔技术以及采用常规技术制作LTCC基板的简要工艺。
3
It is used as protect coating of rigid and flexible circuit board, for example: it serves as coat of thick filmcircuit, porous membrane substrate and prefabricated circuit.