| 单词 | 晶圆片 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 释义 | 晶圆片 noun —wafer nSee also:晶圆 pl—wafers pl 晶圆—wafer (silicon medium for integrated circuit) 晶片—chip • wafer 晶片 pl—wafers pl
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EpiPro5000-IG已在电源设备生产商中找到一个小生存环境，这些厂商需要强大的生产工具来生产厚度为50-150微米的高度统一的、单 位 晶圆片 成 本 低的薄膜。 tipschina.gov.cn | The EpiPro 5000-IG has found a niche with power device producers that need a robust production tool for film [...] thicknesses of 50 - 150 microns with high [...] uniformity and low cost per wafer," said Andrew Goode, [...]president of CSD Epitaxy. tipschina.gov.cn |
Kilopass公司有574项已获得批准或正在申请的专利，十余家代工厂和集成器件生产商(IDM)的相 关 晶圆片 出 货 量已超过80万片，该公司拥有超过100家为移动通信、多媒体/娱乐和网络应用设计半导体元件及设备的客户。 tipschina.gov.cn | With 57 patents granted or pending, and [...] more than 800,000 wafers shipped by a dozen [...]foundries and Integrated Device Manufacturers [...](IDMs), Kilopass has more than 100 customers designing semiconductor components and equipment for mobile communications, multimedia/entertainment, and networking applications. tipschina.gov.cn |
在圆晶片离开 生产线之前，单晶硅必须经过无数次工艺操作……从单晶硅拉伸工艺开始。 schaeffler.cn | Before the finished wafer leaves the production [...] line, the silicon single crystal must undergo numerous process operations... [...]These start with the crystal pulling process. schaeffler.us |
康代先进的反馈和前馈程序控制正在进行专利申请，它支持对位置 （ 晶片 图 ） 、 晶 粒 旋 转、定位和外观缺陷进 行 晶圆 级 封装检测和测量。 cn.camtek.co.il | Camtek's patent pending Feed Back and Feed [...] Forward [...] advanced process control supports WLP inspection for Location (Wafer Map), Die Rotation, Position [...]and Surface defects [...](Particles, scratches) and Metrology. camtek.co.il |
在半导体工业中，PEEK常用来制造晶圆 承 载 器、电子绝缘膜片以及各种连接器件，此外还可用于 晶 片 承 载片（ Wafer Carriers ）绝缘膜、连接器、印刷电路板、高温接插件等。 china-otem.com | In the semiconductor industry, PEEK used to manufacture wafers bearing, electronic insulating membrane and a variety [...] of connection devices, can also be used chips carrying pieces (Wafer Carriers) insulating films, connectors, printed circuit boards, [...]high temperature connectors, etc. In addition, PEEK can be used in μg/L ultra-pure water delivery, storage devices, such as piping, valves, pumps and volume, etc.. china-otem.com |
讀取自其通行證電腦晶片內的 個人資料會 儲存在電腦系統內，以供日後進行出入境檢查時核實身份。 legco.gov.hk | Personal information [...] in the computer chip of the EEP will [...]be retrieved and recorded in the computer system for future immigration verification. legco.gov.hk |
得可VectorGuard [...] Platinum钢网的卓越印刷性能意味着这项技术非常理想地适合一系列高要求的制造应用，它们包括球栅阵列、直接芯片贴合、倒装 芯 片 和 晶圆 级 封 装。 dekpsp.com | DEK VectorGuard Platinum’s superior print performance means that the technology is ideally suited to [...] a range of demanding manufacturing applications including BGAs, direct chip [...] attach, flip chip and wafer level packaging. dekpsp.com |
SVTC运营副总裁Don Kemp表示：“东亚地区目前的测试晶圆 和 晶圆 服 务 供应链的一大特征是 芯 片 制 造 商和代理商之间缺乏协调 ， 晶圆 和 晶圆 服 务 质量的一致性得不到保证。 tipschina.gov.cn | The current supply [...] chain for test wafers and wafer services in East Asia is characterized by an uncoordinated mix of chip-makers and brokers, which results in an inconsistent quality in wafers and wafer services," [...]said Don Kemp, VP of Operations for SVTC. tipschina.gov.cn |
在 MEMS(微机电系统) 装置、LED（发光二极体）晶片及小型电子零件等等的制造商，若是在封装与组装等制程中导入 本技术之后，可让高价的金材料毫无浪费的有 100%的使用效率(材料可封装在产品上的比例)，让 密封外框与电极等的微细图案可以一次就在 矽 晶圆 形 成。 tanaka.com.cn | By implementing the bonding technology in packaging and assembly processes, manufacturers of MEMS (micro electro mechanical systems) devices, LED (light emitting diode) chips and small-sized chip electronic components can form fine patterns on silicon wafers for sealing frames and electrodes at once without any waste and a 100% usage rate (the ratio of material that can be mounted on a product) of expensive gold material. pro.tanaka.co.jp |
我们与Advantec的合作关系以及过往的成功历史将为亚洲客户提供最高品质的测 试 晶圆 和 服 务，同时客户可畅通无阻地与作为制造商的我们取得联系。 tipschina.gov.cn | Our successful history and relationship with Advantec will [...] provide customers in Asia with the [...] highest quality test wafers and services along [...]with unimpeded access to us as a manufacturer. tipschina.gov.cn |
作为面向要求高可靠性的军事及航空航天市场的长期供应商，API 对整个晶圆制造 和产品装配工艺执行过程间检验。 digikey.cn | As an ongoing supplier to the high reliability markets of [...] military and aerospace, API performs in-process [...] inspection throughout the wafer fabrication and [...]product assembly processes. digikey.ca |
晶晨半导体是一家技术领先的系统单 晶片 （ So C） 无 晶圆 半 导 体公司，为包括平板电脑，OTT/ IP机顶盒，基于Android的智能电视等多媒体消费类电子产品提供系统解决方案。 tipschina.gov.cn | Amlogic is a [...] leading fables system-on-chip (SoC) company that provides [...]open platform solutions for multimedia consumer devices [...]including value-line tablets, OTT/IP STBs and Android-based Smart TVs. tipschina.gov.cn |
公司总部和先进的晶圆制造工厂位于美国加利福尼亚州圣何塞，并在整个美洲、欧洲和亚洲设立了区域销售和支持办事处以及先进的技术设计中心。 digikey.cn | Corporation headquarters and [...] state-of-the-art wafer fabrication facilities [...]are located in San Jose, California with regional [...]sales and support offices and advanced technology design centers situated throughout the Americas, Europe and Asia. digikey.ca |
为广泛的消费电子产品提供领先解决方案的 无 晶圆 半 导 体厂商-晶晨半导体（Amlogic）今天宣布正式推出其最新的高性能高清计算平台AML8 72 6 - M 片 上 系 统。 amlogic.com.cn | Nov.11, 2010-Amlogic, a leading fabless semiconductor company providing advanced solutions for a wide range of consumer applications, today announced the availability of Amlogic's newest high-performance HD computing platform, the AML8726-M system on chip (SoC). amlogic.com |
在買賣過程中， [...] 狗隻繁殖者許可證持有人須向動物售賣商提供其許可證編號及 狗隻的微型晶片編號。 legco.gov.hk | A dog breeder permit holder will need to provide his permit [...] number and the microchip number of the [...]dogs to an animal trader during the sale transaction. legco.gov.hk |
此外，中芯代成都成芯半導體製造有限公司經營管 理一座 200mm 晶片廠， 也代武漢新芯集成電路製造有限公司經營管理一座 300mm 晶片廠。 cre8ir.com | In addition, SMIC manages and [...] operates a 200mm wafer fab in Chengdu owned by Cension Semiconductor Manufacturing Corporation and a 300mm wafer fab in Wuhan [...]owned by Wuhan Xinxin [...]Semiconductor Manufacturing Corporation. cre8ir.com |
联华电 子的尖端晶圆专工技术协助客户产出速度更快、效能 更强的芯片，满 足今日应用产品的需要。联华电子的 尖端技术包括高介电系数／金属闸极、低电介值、浸 润式微影术与混合信号／RFCMOS等技术。 umc.com | UMC's leading-edge foundry technologies enable the creation of faster and more powerful chips to meet today's [...] demanding applications, [...]including, gate-last high-k/metal gate, low-k dielectrics, immersion lithography, and mixed signal/RFCMOS. umc.com |
本软件控制解决方案旨在通过将批量 Manager 配合 [...] Molly 使用来为研究和生产分子束外延 (MBE) 系统实现晶片传送控制自动化。 veeco.com.cn | This software control solution is designed for both research and production [...] molecular beam epitaxy (MBE) systems, with Lot Manager working together with [...] Molly for automated wafer transfers control. veeco.com |
科技園公司預計，由於集成電路設計 、 晶 圓 片 定期代工、測試開發、可靠性測試和產品分析等方面所涉及的資金和資源 [...] 會由眾多用戶分擔，加上中心採用以使用時間計算的收費模式，個別 用戶開發新產品所需的成本和周期時間最多可望減省六成。 legco.gov.hk | HKSTPC estimates that as the capital and [...] resources in IC design, wafer shuttle, test development, [...]reliability and product analysis, [...]etc. will be shared out among a large number of users, and with a time-based charging scheme, individual users may expect to reduce the product development cost and cycle time by as much as 60%. legco.gov.hk |
主機連線會連至進階主機控制器介面 (AHCI)，此介面一般位 於主機晶片組，功能是做為 PCIe 匯流排上的主機介面卡。 seagate.com | The host connection is to an advanced host controller interface (AHCI), which usually [...] resides in the host chipset as the host adapter [...]on the PCIe bus. seagate.com |
这位于美国加州的设计中心与安森美半导体位于罗马尼亚布加勒斯特(Bucharest)的设计中心密切协作，共同推进新的知识产权(IP)开发、IC设计和布线，以及针对E2PROM存储器产品和包括LED驱动器、稳压器、温度传感器、电压监控器、数字电位计和总线产品在内的宽广范围模拟/混合信号IC的下一 代 晶圆 厂 工 艺技术开发。 onsemi.cn | The design center located in Santa Clara, California works in tandem with the ON Semiconductor Design Center in Bucharest, Romania for new IP development, IC design and layout, and next-generation foundry process technology development for E2PROM memory products and a wide range of analog/mixed-signal ICs, including LED drivers, voltage regulators, temperature sensors, voltage supervisors, digital potentiometers and bus products. onsemi.com |
光市位于日本第一大岛 [...] 本州岛的西南海岸上，这里生产半导体工业用 硅 晶片 以及 世创电子材料其它生产基地和太阳能光伏产业用单晶硅。 reports.wacker.com | Located on the southwest coast of [...] Japan’s main island of Honshu, [...] Hikari produces silicon wafers for the semiconductor [...]industry and monocrystals for other [...]Siltronic sites and for the solar industry. reports.wacker.com |
我们了解到12英寸晶圆生产正在增长。 tss.trelleborg.com | We understand 12-inch wafer production is increasing. tss.trelleborg.com |
12 英寸晶圆质量 要求相当高，所以加工系统中的每一项都必须符合最高标准。 tss.trelleborg.com | Quality is more critical in 12-inch fabrication, so everything in the processing system must meet the highest requirements. tss.trelleborg.com |
晶片加工 设备、单结晶制造设备、曝光·成像清晰度设备、保护剂处理设备、蚀刻设备、干蚀刻设备、热处理设备、薄膜开成设备（CVD设备、溅射设备、其他）、离子注入设备、CMP设备、洗涤干燥设备、各种搬运系统·设备、纯水·药液·水处理设备、各种气体设备、切割成片设备、微型·纳米金属模、纳米刻印制造设备、离子束加工设备、微小放电加工设备、片成形设备、挤压/浇铸/喷射成形设备、加压成形设备、激光微型加工设备、成膜加工设备、干燥炉、烧成/烧结设备、微波加热设备、熔融工序设备、粉碎工序设备、超声波加工机 、 晶片 接 合 设备（校准器）、深挖蚀刻设备（面向MEMS）、清洁室设备等。 jpcashow.com | Wafer processing equipment, single crystal production device, exposure/depiction device, resist processing equipment, etching equipment, dry etching device, heat processing device, thin film forming device (CVD devices, sputtering devices, etc.), ion injection device, CMP equipment, cleaning-drying equipment, various transportation systems and equipment, pure water/chemical liquid/water processing equipment, various gas devices, dicing equipment, micro/nano dies, nano imprint device, ion beam processing equipment, micro radiation processing equipment, sheet forming equipment, extrusion/casting/injection molding machine, pressurized forming equipment, laser micro processing equipment, thin film coating equipment, drying furnaces, burning/sintering equipment, microwave heating equipment, dissolution process equipment, fracturing process equipment, ultrasound processing equipment, wafer bonding equipment [...] (aligner), deep etching [...]equipment (for MEMS), clean room equipment, etc. jpcashow.com |
在这一年里，他们首次超越了日本成为全球半导体产业这艘巨轮上的“大副”;存储器领域的竞争，也几乎成了韩国的“内战” ; 在 晶圆 代 工 领域，三星也以六成以上的增长率上升至第四位，把中芯国际甩在身后;就先进工艺而言，韩国企业也让业界震惊——海力士甚至宣布15nm的NAND Flash技术已经成熟，预计在2012年下半年投入量产。 xkzd.net | In this year, their first surpassed Japan to become the global semiconductor industry this a large ship " chief"; memory areas of the competition, has almost become South Korea's" civil war"; in the foundry field, Samsung also into more than six growth rate rose to fourth, the international of the core in the behind behind; advanced process, Korea enterprise also let industry shocked -- has even announced that the 15nm NAND Flash technology has matured, expected in the second half of 2012 into production. xkzd.net |
利 用金粒子的图案转印技术，让以往很困难的 200°C 低温下进行晶圆级金 属－金属接合变成可能， 吸收接合面的高低差，而让优越的高耐热性、高可靠度的气密封装与电路接合变成可能。 tanaka.com.cn | Using the transferred pattern of gold [...] particles which have an [...] effect on absorbing wafer surface roughness, it is possible to achieve metal-metal bonding on a wafer level at the [...]low temperature of 200°C, [...]which had been difficult by using conventional technology, with enabling high temperature resistance, high reliability hermetic seals and electrical connections. pro.tanaka.co.jp |
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