| 单词 | 晶圆 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 释义 | 晶圆 noun, plural —wafers pl晶圆 —wafer (silicon medium for integrated circuit)Examples:晶圆片 n—wafer n 无晶圆—fabless (semiconductor company) See also:晶 n—crystal n 圆—circular • justify • tactful • spherical • unit of Chinese currency (Yuan) • (of the moon) full 圆 n—circle n
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我们与Advantec的合作关系以及过往的成功历史将为亚洲客户提供最高品质的测 试 晶圆 和 服 务，同时客户可畅通无阻地与作为制造商的我们取得联系。 tipschina.gov.cn | Our successful history and relationship with Advantec will [...] provide customers in Asia with the [...] highest quality test wafers and services along [...]with unimpeded access to us as a manufacturer. tipschina.gov.cn |
作为面向要求高可靠性的军事及航空航天市场的长期供应商，API 对整个晶圆制造 和产品装配工艺执行过程间检验。 digikey.cn | As an ongoing supplier to the high reliability markets of [...] military and aerospace, API performs in-process [...] inspection throughout the wafer fabrication and [...]product assembly processes. digikey.ca |
公司总部和先进的晶圆制造工厂位于美国加利福尼亚州圣何塞，并在整个美洲、欧洲和亚洲设立了区域销售和支持办事处以及先进的技术设计中心。 digikey.cn | Corporation headquarters and [...] state-of-the-art wafer fabrication facilities [...]are located in San Jose, California with regional [...]sales and support offices and advanced technology design centers situated throughout the Americas, Europe and Asia. digikey.ca |
12 英寸晶圆质量 要求相当高，所以加工系统中的每一项都必须符合最高标准。 tss.trelleborg.com | Quality is more critical in 12-inch fabrication, so everything in the processing system must meet the highest requirements. tss.trelleborg.com |
这些系统以高度可扩展的喷淋头概念为基础，提供直径从50毫米到300毫米尺寸不等 的 晶圆 供 选 择。 aixtron.com | The systems are based on the highly scalable showerhead concept and [...] are available for wafer-sizes from 50mm [...]to 300mm diameter. aixtron.com |
大批量成像工艺，包括得可专利的ProFlow®技术，由我们的精密钢网设计和生产能力以及和得可一起开发的 Ad e p t 晶圆 处 理 系统所支持。 dek.com | The mass imaging process, including DEK's patented ProFlow® technology, is supported by our [...] precision stencil design and production [...] capabilities, and the Adept wafer handling systems [...]developed in conjunction with DEK. dek.com |
这位于美国加州的设计中心与安森美半导体位于罗马尼亚布加勒斯特(Bucharest)的设计中心密切协作，共同推进新的知识产权(IP)开发、IC设计和布线，以及针对E2PROM存储器产品和包括LED驱动器、稳压器、温度传感器、电压监控器、数字电位计和总线产品在内的宽广范围模拟/混合信号IC的下一 代 晶圆 厂 工 艺技术开发。 onsemi.cn | The design center located in Santa Clara, California works in tandem with the ON Semiconductor Design Center in Bucharest, Romania for new IP development, IC design and layout, and next-generation foundry process technology development for E2PROM memory products and a wide range of analog/mixed-signal ICs, including LED drivers, voltage regulators, temperature sensors, voltage supervisors, digital potentiometers and bus products. onsemi.com |
在该方法中，薄膜通过化学反应发生沉积，其 中 晶圆 会 接 触到气体混合物，并 在 晶圆 表 面发生化学反应。 aixtron.com | Applying this methodology, the deposition of thin films takes [...] place by means of chemical [...] reactions, in which the wafers are exposed to a gas mixture that reacts on the wafer surface. aixtron.com |
将直径为 0.2mm [...] 的焊球以细间距的精度放置于基板或 晶圆 级 ， 球栅阵列和GORE snapSHOT™ 工艺中使用的焊球最大直径为 [...]0.75mm 和 0.89mm。 dek.com | Available for 0.2mm diameter solder balls with fine-pitch [...] accuracy at substrate or wafer level, up to the larger [...]ball diameters of 0.75mm and 0.89mm [...]as used in BGAs and the GORE snapSHOT™ process . dek.com |
SVTC运营副总裁Don Kemp表示：“东亚地区目前的测试晶圆 和 晶圆 服 务 供应链的一大特征是芯片制造商和代理商之间缺乏协调 ， 晶圆 和 晶圆 服 务 质量的一致性得不到保证。 tipschina.gov.cn | The current supply [...] chain for test wafers and wafer services in East Asia is characterized by an uncoordinated mix of chip-makers and brokers, which results in an inconsistent quality in wafers and wafer services," [...]said Don Kemp, VP of Operations for SVTC. tipschina.gov.cn |
最近，我们已经开始纵向发展， 自行生产硅晶圆，这 将帮助我们在未来的几年中，将太阳能板的生产成本降低到每瓦一澳元以下。 australiachina.com.au | Most recently, we have begun to vertically [...] integrate into silicon wafer manufacturing capacity, [...]which we anticipate will bring our solar [...]panel production costs down below one dollar per watt within the next few years. australiachina.com.au |
利 用金粒子的图案转印技术，让以往很困难的 200°C 低温下进行晶圆级金 属－金属接合变成可能， 吸收接合面的高低差，而让优越的高耐热性、高可靠度的气密封装与电路接合变成可能。 tanaka.com.cn | Using the transferred pattern of gold [...] particles which have an [...] effect on absorbing wafer surface roughness, it is possible to achieve metal-metal bonding on a wafer level at the [...]low temperature of 200°C, [...]which had been difficult by using conventional technology, with enabling high temperature resistance, high reliability hermetic seals and electrical connections. pro.tanaka.co.jp |
满足生产环境的产品晶圆台式 测绘系统，21 秒内能测量 15 个点。 cn.filmetrics.com | Production-ready [...] tabletop patterned-wafer thickness mapping [...]system capable of 15-points in 21 seconds. filmetrics.com |
在 GaN功率器件和功率MOSFET的晶 圆制造成本之间没有材料方面的差 异。 epc-co.com | There are no material differences [...] between the cost of wafer fabrication of [...]a GaN power device and a power MOSFET. epc-co.com |
得可VectorGuard [...] Platinum钢网的卓越印刷性能意味着这项技术非常理想地适合一系列高要求的制造应用，它们包括球栅阵列、直接芯片贴合、倒装芯片 和 晶圆 级 封 装。 dekpsp.com | DEK VectorGuard Platinum’s superior print performance means that the technology is ideally suited to [...] a range of demanding manufacturing applications including BGAs, direct chip [...] attach, flip chip and wafer level packaging. dekpsp.com |
实时 SPC 与专家系统功能独特结合，使 FabGuard FDC [...] 成为当今市场上最强大的系统，可以用于检测问题以避 免 晶圆 损 失 并减少计划外设备停工时间。 inficondisplay.com | The unique combination of real-time SPC and expert systems capabilities make FabGuard FDC [...] the most powerful system available for detecting [...] problems to prevent wafer loss and reduce unscheduled [...]equipment downtime. inficondisplay.com |
Gutmann先生加入安森美半导体之前，于1982年至1999年在摩托罗拉公司担任过不同财务职位，包括不同部门及离 岸 晶圆 和 后工序工厂总监、财务及会计经理、财务规划经理及财务分析师。 onsemi.cn | Prior to joining ON Semiconductor, Gutmann served in various financial positions with Motorola, Inc. from 1982 to 1999, [...] including controller of various [...] divisions and an off-shore wafer and backend factory, [...]finance and accounting manager, financial [...]planning manager and financial analyst. onsemi.com |
目前宜普公司的所有晶圆工艺都由 Episil公司负责，这是一家著名的台湾 [...] 代工厂。 epc-co.com | Today, EPC [...] processes all their wafers in Episil Inc. epc-co.com |
我们了解到12英寸晶圆生产正在增长。 tss.trelleborg.com | We understand 12-inch wafer production is increasing. tss.trelleborg.com |
上海华虹NEC电子有限公司（HHNEC）是中国大陆第一条8英 寸 晶圆 代 工线的提供商，拥有先进的的CMOS工艺技术和制造设备，并拥有ISO质量体系认证（包括ISO9001和ISO14001）以及符合BS7799标准的服务支持系统。 hhnec.com | Shanghai Hua Hong NEC Electronics Company Limited [...] (HHNEC) is the first 8" wafer foundry provider in [...]Mainland China with state-of -the-art [...]CMOS Process technology, manufacturing equipment and ISO certification (both ISO9001 and ISO14001) and BS7799 qualified service support system. hhnec.com |
Nordson DAGE 4300 焊接强度测试仪完善了经过实践证明的半自动 4000W 晶圆处理 系统，并且依照半导体制造车间和转包商的严格标准设计，可以满足不断增长的3 00 mm 晶圆的处理和凸块剪切力需求。 micropowergroup.com | The Nordson DAGE 4300 bondtester [...] complements the proven [...] semi-automatic 4000W Wafer Handling System and has been designed in accordance with the strict standards of semiconductor foundries and subcontractors to meet the growing demand for handling and bump shear testing on 300mm wafers. micropowergroup.com |
为防止因手工移动晶圆致使 设备效率降低以及因表面接触引起产品质量降低，我们新近开发出了在Growth Block自动装载晶圆的装置。 smartfactory.lgcns.com | We developed and supplied a new automated wafer loading machine to prevent the compromised product quality from surface contamination resulting from manual loading errors. smartfactory.lgcns.com |
其主要产品包括 晶圆键合 、光刻 / 纳米压印光刻（ NIL ）和计量设备，以及光阻涂布机、清洁器和检验系统等。 evgroup.com | Key products include wafer bonding, lithography/nanoimprint [...] lithography (NIL) and metrology equipment, as well as photoresist [...]coaters, cleaners and inspection systems. evgroup.com |
联华电 子的尖端晶圆专工 技术协助客户产出速度更快、效能 更强的芯片，满足今日应用产品的需要。联华电子的 [...] 尖端技术包括高介电系数／金属闸极、低电介值、浸 润式微影术与混合信号／RFCMOS等技术。 umc.com | UMC's leading-edge foundry technologies [...] enable the creation of faster and more powerful chips to meet today's demanding [...]applications, including, gate-last high-k/metal gate, low-k dielectrics, immersion lithography, and mixed signal/RFCMOS. umc.com |
我们是世界领先的成像解决方案的公司之一;提供CMOS图像传感器，图像处理器 ， 晶圆 级 相 机模块，和无可匹敌的技术和商业头脑予世界各地的客户。 cytech.com | We're one of the world's leading imaging-solutions [...] company; providing CMOS image sensors, [...] image processors, wafer-level-camera modules, [...]and peerless technical and business [...]acumen to customers around the globe. cytech.com |
业界领先的模拟/混合信号晶圆厂和 “超越摩尔定律”技术领域的专家，X-FAB [...] Silicon Foundries，今天发表了一款全面的模拟/混合信号互补金属氧化物半导体(CMOS)高温制程工艺－XA035，可用于操作温度高至摄氏175度的集成电路(IC)。 xfab.com | X-FAB Silicon Foundries, the leading [...] analog/mixed-signal foundry and expert in “More than Moore” technologies, today announced [...]XA035, a comprehensive, analog/mixed-signal complementary metal-oxide-semiconductor (CMOS) high-temperature foundry process for integrated circuits (ICs) requiring operating temperatures up to 175 degrees Celsius. xfab.com |
在前工序阶段，需要将硅晶圆和化 合物半导 体 晶圆 按 照 以下顺序进行各工序的处理，从而在基板上直接生成发光元件和光接收元件。 kyosemi.co.jp | The front-end process refers to the formation of the light-emitting and [...] photo-detecting elements directly on the [...] silicon or compound semiconductor wafer and provides a process flow [...]in the procedure below. kyosemi.co.jp |
2011 年 3 月 8 日 ， 中国国际半导体设备与材料展览会暨研讨会 —— 今天 ， 世界领先的先进半导体与封装 、 微机电系统 、 硅绝缘体 （ [...] SOI ） 和 新兴 纳米技术市场 晶圆键合 与光刻设备应供应商 EVG [...]宣布 ， 其产品组合中再添新成员 。 evgroup.com | STRATEGIES IN LIGHT, Santa Clara, Calif., February 22 , 2011 - EV Group (EVG), a leading supplier of wafer-bonding and lithography equipment for the advanced semiconductor and packaging, MEMS, [...] silicon-on-insulator (SOI) and emerging [...] nanotechnology markets, today announced the [...]latest addition to its portfolio of products [...]created to optimize the manufacture of high-brightness light-emitting diodes (HB-LEDs), compound semiconductors and power electronics. evgroup.com |
在这一年里，他们首次超越了日本成为全球半导体产业这艘巨轮上的“大副”;存储器领域的竞争，也几乎成了韩国的“内战” ; 在 晶圆 代 工 领域，三星也以六成以上的增长率上升至第四位，把中芯国际甩在身后;就先进工艺而言，韩国企业也让业界震惊——海力士甚至宣布15nm的NAND Flash技术已经成熟，预计在2012年下半年投入量产。 xkzd.net | In this year, their first surpassed Japan to become the global semiconductor industry this a large ship " chief"; memory areas of the competition, has almost become South Korea's" civil war"; in the foundry field, Samsung also into more than six growth rate rose to fourth, the international of the core in the behind behind; advanced process, Korea enterprise also let industry shocked -- has even announced that the 15nm NAND Flash technology has matured, expected in the second half of 2012 into production. xkzd.net |
在半导体工业中，PEEK常用来制造晶圆 承 载器、电子绝缘膜片以及各种连接器件，此外还可用于晶片承载片（ [...] Wafer Carriers ）绝缘膜、连接器、印刷电路板、高温接插件等。 china-otem.com | In the semiconductor industry, PEEK [...] used to manufacture wafers bearing, electronic [...]insulating membrane and a variety of [...]connection devices, can also be used chips carrying pieces (Wafer Carriers) insulating films, connectors, printed circuit boards, high temperature connectors, etc. In addition, PEEK can be used in μg/L ultra-pure water delivery, storage devices, such as piping, valves, pumps and volume, etc.. china-otem.com |
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