单词 | 倒装 | ||||||||||||||||||||||||||||||||||||||||||||
释义 | 倒装 —anastropheless common: inversion (rhetoric device of inverting the word order for heightened effect) Examples:倒装句—anastrophe • inversion (rhetoric device of inverting the word order for heightened effect) See also:倒 (...) v—fall v • invert v • collapse v • sell v • pour sth. v 倒—however • fail • actually • topple • place upside down • move around • move backwards • profiteer • go bankrupt • throw out • as a matter of fact • contrary expectation • change (trains or buses)
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我们这个倒装监控室可以说是列车的心脏”,Stefan Hrubesch的目光扫过控制室继续介绍说,“所有与集装箱和运载列车有关的信息都在这里汇总”。 reports.wacker.com | For us, Loading Control is the heart of a train,” says Stefan Hrubesch as he glances around the control center. reports.wacker.com |
C 系列反向几何 MLCC - TDK 的反向几何或“倒装式” 电容器提供具有 “ 倒装 式 ”几何结构的业界标准外壳尺寸。 digikey.cn | C Series Reverse Geometry MLCCs - TDK’s Reverse Geometry or "Flip-type" capacitors offer industry standard case sizes in a “flipped” geometry construction. digikey.ca |
倒装式几何形状要求沿着 MLCC 的长度而非宽度方向应用端接。 digikey.cn | The flipped geometry requires the termination to be applied along the length of the MLCC instead of the width. digikey.ca |
2010年,先锐公司推出了新型倒装模具 专用热流道系统-PCM SYSTEM。 cn.industrysourcing.com | In 2010, SINO successfully developed a new type hot runner [...] system special in invert mold--- PCM SYSTEM. us.industrysourcing.com |
我们的小信号肖特基二极管以及倒装 片 和SOD-923器件有助于满足最严格的空间节省要求,特别是便携式通信设备。 st-japan.co.jp | Our range of small-signal Schottky diodes with flip-chip and SOD-923 devices helps meet the most stringent space-saving requirements, especially for portable communication equipment. st-japan.co.jp |
得可VectorGuard [...] Platinum钢网的卓越印刷性能意味着这项技术非常理想地适合一系列高要求的制造应用,它们包括球栅阵列、直接芯片贴合 、 倒装 芯 片和晶圆级封装。 dekpsp.com | DEK VectorGuard Platinum’s superior print performance means that the technology is ideally suited to [...] a range of demanding manufacturing applications including BGAs, direct chip attach, [...] flip chip and wafer level packaging. dekpsp.com |
无尘室级别:工艺可以在1000级运行,但 是 倒装 芯 片 只能在100级运行。 dek.com | Clean Room Classification: Process can be run in class 1000 but flip chip at class 100. dek.com |
Galaxy能处理各种晶圆级、基板级和印制电路板级的高精度应用,对 于 倒装 芯 片 、微型球栅阵列和超细间距表面贴装技术而言是理想的设备。 dek.com | Equipped to handle a range of high accuracy applications at [...] wafer, substrate and board level, Galaxy is ideal [...] for complex packages such as flip-chips, [...]uBGAs and ultra fine pitch SMT. dek.com |
Allegro 确实提供一些倒装芯片 器件,但即使高温焊料可能存在于器件内部,所使用的 [...] 100% 雾锡引脚框电镀可消除器件裸露区域的铅。 zh.allegromicro.com | Allegro does supply some flip-chip devices, [...] however, even though high-temperature solder may be present in the interior [...]of the device, 100% matte tin leadframe plating is used, eliminating Pb from the exposed areas of the devices. allegromicro.com |
・ 在集成电路组件(倒装芯片 )的内部半导体 芯片及载子间形成可靠电气连接所需的焊锡 中的铅 ricoh.com | Lead contained in solder composed of more than two kinds of elements, and is used for joining pin and package of microprocessor, of which lead content is more than 80wt% and les than 85wt%. ricoh.com |
对于技术豁免方面,内部倒装法(使用密封在器件封装内部的高温铅合金焊料块的先进技术)用于某些器件系列,如 [...] Allegro ACS704 至 ACS708 以及 ACS760 器件系列(关于本信息请参阅个别产品数据手册)。 zh.allegromicro.com | With regard to technology [...] exemptions, internal flip-chips, an advanced [...]technology that uses high-temperature Pb-alloy solder [...]bumps sealed inside of the device package, are used in certain device families, such as the Allegro ACS704 through ACS708, and the ACS760 device families (refer to the individual product datasheets for this information). allegromicro.com |
以最尖端、未来技术为中心的高密度·高频率安装技术应用产品、高密度基片·插件、内置零部件的印刷电路板、组件内系统(SiP)/芯片上系统(SoP)、显示·光器件/传感器、高密度安装相关材料、各种糊剂、无铅焊锡/接合材料、封固树脂、粘接剂·欠装材料、热对策材料·坯料、高频率应对聚合物、各种接合器(接线机、管芯焊接机、LCD/COG接线等)、配合 器 · 倒装 片 (FC)安装·BGA/CSP组装·TAB安装·OLB/ILB系统·COB系统等各种高密度安装相关系统·设备、生产设备、相关书籍等。 jpcashow.com | Leading-edge products based on futuristic high-density or high-frequency packaging technologies, high-density substrates and interposers, component contained boards, semiconductor chips, systems in package (SiP), systems on chip (SoC), indication/optical devices and sensors, materials related to high-density packaging, pastes, lead-free solder and junction materials, sealing resins, adhesives, and underfill materials, anti-heat materials, high frequency [...] ready polymer, systems and devices related to [...] high-density packaging such as bonders [...](e.g. wire bonders, die bonders, and LCD/COG [...]bonders), dispensers, flip chip (FC) packaging, BGA/CSP assembly, TAB packaging, OLB/ILB systems, and COB systems and production facilities, and related books. jpcashow.com |
为了把“主席用瓷”制作得尽善尽美,专窑职工选用特制的本省“洪江泥”作碗坯,绘画用氧化铀作颜料,大胆将坯 体 倒装 入 窑 ,先经1360摄氏度的高温成瓷,然后在碗口上施一层白色低温釉,再经700摄氏度的低温烧烤。 xhwcn.com | In order to get "chairman made of porcelain" perfection, designed kiln worker choose special province is necessary "mud" as a bowl of billet, painting with uranium oxide pigments, bold will be blank flip into the kiln body, by the high temperature of 1360 degrees Celsius, a China and then apply a layer of white on the bowl low-temperature glaze, then through 700 degrees Celsius temperature barbecue. xhwcn.com |
陶氏电子材料事业群在电镀化学的发明和创新方面具有悠久的历史,而且我们所提供的产品组合中的很多材料对于最尖端的晶圆 级 倒装 芯 片 、系统级封装、层叠封装和3D封装结构来说都是非常重要的材料。 dowelectronicmaterials.com | Dow Electronic Materials has a long history of invention and innovation in electroplating chemistry, and the company’s portfolio delivers many of the materials that are essential for the most advanced wafer-level, flip chip, system-in-package, package-on-package and 3D packaging schemes. dowelectronicmaterials.com |
Condor 300型报告了每个裸片的凸点共面性,确保可靠的 包 装倒 转 芯 片。 cn.camtek.co.il | Condor 300 models report bump coplanarity for each die to [...] ensure reliable flip-chip packaging. camtek.co.il |
此选购件不能用在下端安装或 P 型压力表上,并且必须在 工厂安装到 M 型压力表上。 swagelok.com.cn | This option is not available on lower mount or P model gauges and must be factory installed on M model gauges. swagelok.com.cn |
根据《公约》第 3 条的规定,在和平时期为预 防军事冲突对文化财产造成后果而采取的保护 [...] 措施包括:编制目录,为保护文化财产而制定 预防建筑物火灾或倒塌的应急措施,做好可移 动文化财产的移出或有效保护的准备工作,以 [...]及确定负责文化财产保护的主管机构。 unesdoc.unesco.org | Preparatory measures taken in time of peace for the safeguarding of cultural property against the foreseeable effects of an armed conflict pursuant to Article 3 of the Convention shall include, as appropriate, the preparation of inventories, the 34 planning of [...] emergency measures for protection against fire [...] or structural collapse, the preparation [...]for the removal of movable cultural property [...]or the provision for adequate in situ protection of such property, and the designation of competent authorities responsible for the safeguarding of cultural property. unesdoc.unesco.org |
例如,这里的评注似可作如下说明:(f)项——筹资安排所在地或筹资批准所在地 或债务人主要银行所在地——只在银行控制债务人的情况下才相关;(k)项——雇 员所在地——或许在雇员可能成为未来债权人的情况下才相关,但如果以下述 几点为依据就不那么重要了:对雇员的保护更多的是保护相关方权利问题,与 主要利益中心分析无关,而且《示范法》第 22 条无论如何都已处理这一问题; (e)项——适用于大部分争议的法律所属的法域,其重要性不足以成为一项决定 性因素,而且这种法域在任何情况下都有可能是一个与债务人的管理地或业务 实施地无关的法域,比(e)项更重要的因素 反 倒 是 债 务人的管理地或业务实施 地。 daccess-ods.un.org | That commentary might suggest, for example, that (f) the location from which financing was organized or authorized or the location of the debtor’s primary bank, would only be important where the bank controlled the debtor; that (k) the location of employees, might be important where employees could be future creditors, or less important on the basis that protection of employees is more an issue of protecting the rights of interested parties, is not relevant to the COMI analysis and is, in any event addressed by article 22 of the Model Law; that (e) the jurisdiction whose law would apply to most disputes, was not sufficiently important to be a determining factor and could, in any event, be a jurisdiction unrelated to the place from which the debtor was managed or conducted its business, factors that were both considered to be more important than (e). daccess-ods.un.org |
就象 1989 年后我们帮助推倒柏林墙的人建立起 健全的民主政体和市场经济那样;就象 [...] 1994 年我们 欢迎南非选择走和解与民主而非种族冲突的道路,因 而重返英联邦那样;如今在 2011 年,在北非和中东 人民挺身而起,表达他们希望建立更开放、更民主的 [...] 社会之时,我们有机会,同时也有责任,去 帮助他们。 daccess-ods.un.org | Just as after 1989 we helped those [...] who tore down the Berlin Wall to [...]build robust democracies and market economies, just [...]as in 1994 we welcomed South Africa back into the commonwealth of nations when it chose the path of reconciliation and democracy instead of racial conflict, so now in 2011, as people in North Africa and the Middle East stand up and give voice to their hopes for more open and democratic societies, we have an opportunity, and, I would say, a responsibility to help them. daccess-ods.un.org |
冈比亚还报告称,它继 续开展合作,在受影响地区的社区进行雷险教育,而且拥有一支训练有素 、 装备 完善的人道主义排雷队,时刻准备应对任何紧急情况。 daccess-ods.un.org | Gambia also reported that it continues in collaborate to deliver mine risk education in communities in the affected areas and has a well trained and fully equipped humanitarian demining team which is always ready to respond to any emergencies. daccess-ods.un.org |
在同一决议中,安理会决定该部队除了根据第 425(1978) 号和第 426(1978)号决议执行任务外,还将除其他事项外,监测敌对行动的停止; 在以色列国防军撤出时,陪同和支助黎巴嫩 武 装 部 队在整个黎巴嫩南部进行部 署;确保“蓝线”得到尊重,并协助黎巴嫩 武 装 部 队 确保“蓝线”和利塔尼河之 间的地区没有任何未经授权的武装人 员、资产和武器;采取力所能及的一切必要 行动,确保其行动区不被用来进行敌对活动;应黎巴嫩政府的要求协助其保障边 境和其他入境点的安全,防止武器或有关物资未经其许可进入黎巴嫩。 daccess-ods.un.org | By the same resolution, the Council decided that the mandate of the Force, in addition to carrying out its mandate under resolutions 425 (1978) and 426 (1978), would include, inter alia, monitoring the cessation of hostilities, accompanying and [...] supporting the deployment of [...] the Lebanese Armed Forces throughout southern Lebanon in parallel with the withdrawal of the Israeli Defense Forces, ensuring respect for the Blue Line and assisting the Lebanese Armed Forces in ensuring that the area between the Blue Line and the Litani River is free of any unauthorized armed personnel, [...]assets and weapons, taking [...]all necessary action within its capabilities to ensure that its area of operations is not utilized for hostile activities, and assisting the Government of Lebanon, at its request, in securing its borders and other entry points in order to prevent the entry into Lebanon without its consent of arms or related materiel. daccess-ods.un.org |
此外,提议 将一个当地雇员员额改叙为本国干事职等设施管理干事,负责非洲经委会设施管 [...] 理方面的技术文件、设计准备和行政支持,并为照明、供暖、通风和空调系统以 及建筑相关安装提供 所需价值评估工程(同上,第 18A.117 段)。 daccess-ods.un.org | In addition, it is proposed to reclassify one Local level post to the National Officer level for a Facilities Management Officer to provide technical documentation, design preparation and administrative support in the management of ECA facilities, and to provide the required value engineering for the [...] lighting, the heating, ventilation and air conditioning, and [...] architectural-related installations (ibid., para. [...]18A.117). daccess-ods.un.org |
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