单词 | tdk | ||||||||||||||||||||||||||||||||||||
释义 |
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TDK-LAMBDA有他的羽翼未丰的 绿色电源PSU系列GWS [...] 延长与500 W输出功率的GWS500。 zh-tw.developmentscout.com | TDK-Lambdahas his fledgling [...] Green Power PSU series GWS extended by the GWS500 with 500 W output power. en.developmentscout.com |
TDKTCE1210系列构成了第一款薄膜共模滤波器,以便能在单一元件中提供高速共模噪声抑制和ESD保护。 epcos.com | The TDK TCE1210seriescomprises [...] the first thin-film common-mode filter to offer both high-speed common-mode noise suppression [...]and ESD protection in a single component. epcos.com |
TDKCorporation 推出专用于抑制汽车电子器件中电流浪涌脉冲的 [...] E 系列保护器件,扩充了其 EPCOS 多层变阻器的产品范围。 digikey.cn | TDKCorporationhas extended [...] its product range of EPCOS multilayer varistors with the E series, designed to assure protection [...]from current surge pulses in automotive electronics. digikey.be |
而且,在100 °C时TDKPE90的磁心损耗比PE22低23%,使磁通密度曲线陡峭上升,小回路的线性保持到饱和为止。 epcos.com | Furthermore, the core loss ofTDK PE90 material at 100 [...] °C was 23 percent lower than that of PE22, which makes the rise in [...]magnetic flux density steep, and the minor loop’s linearity was maintained right up until it was saturated. epcos.com |
电子元器件B2馆,展位205TDK-LAMBDA公司推出了几款新系列的非隔离Mini-DC/DC-Wandlern的,2。 zh-tw.developmentscout.com | Electronica B2 [...] Hall, Booth 205 TDK-Lambda has introduced [...]several new series of non-isolated Mini-DC/DC-Wandlern that the 2. en.developmentscout.com |
通过把TDK尖端的薄膜图形化技术和紧凑高精确度的线圈图案和终端形成工艺结合使用,我们实现了元件小型化的里程碑。 epcos.com | The milestone in miniaturization [...] was realized using TDK’s leading-edge thin-film [...]patterning technology combined with compact, [...]high-precision coil pattern and terminal formation processes. epcos.com |
现在,TDK正在采用尖端的技术特别为智能手机和结构紧凑的移动设备开发和制造RF元件。 epcos.com | Now,TDK is applyingthe leading-edge [...] technology to the development and manufacture of RF components, especially for smartphones and compact mobile devices. epcos.com |
TDK-EPC公司是TDK集团的分公司,总部位于日本东京,它是TDK的电子元器件部门与德国爱普科斯集团相互整合、于2009年10月1日联合成立的负责开发、制造电子元件的制造公司。 epcos.com | TDK-EPC Corporation, a TDK group company, is the manufacturer of TDK’s electronic components, [...] modules and systems and is [...]headquartered in Tokyo, Japan. TDK-EPC was founded on October 1, 2009 from the combination of the electronic components business of TDK and the EPCOS Group. epcos.com |
TDK公司与卢森堡大学以及卢森堡政府合 作,发起了“光伏电池的半导体材料研 [...] 究项目”。 setupineurope.com | TDK, in partnership with [...] the University of Luxembourg and the government have created a “Chair for research on semiconductor [...]materials for photovoltaic batteries”. setupineurope.com |
上海广联设备先进,技术力量雄厚.公司拥有德国西门子公司的HS-50、S-23HM、80F4、80F5贴片机和日本JUKI公司的KE-2020、KE-2010、KE-760贴片机,可以贴装0.3mm间距的QFP、BGA、CSP以及0201等高精度元器件。其他主要设备还有美国MPM公司的UP-2000和日本JUKI公司的KS-1700全自动丝网印刷机、美国环球公司的轴向自动插件机系统、日本TDK公司的径向自动插件机系统、日本弘辉公司的双波峰焊接机、日本TESCON公司的在线测试仪,日本MK公司的灌封设备及固化生产线。 svainfo.com | Shanghai Guanglian is specialized in the R&D of the network, IT, communication, video, audio products and SMT surface mounting processing of all kinds of high-definition and high density printing circuit board as well as processing of diversified electronic product components Shanghai Guanglian boasts the advanced equipment and considerable technology strength with Siemens HS-50, S-23HM,80F4, 80F5SMT and JUKI's KE-2020, KE-2010 and KE-760SMT as well as the high definition devices like QFP which can mount 0.3mm space, BGA, CSP and 0201, etc. Other major equipments include the UP-2000 from MPM in USA, KS-1700 full-automatic silk screen printer from JUKI in Japan, axial automatic plug-in system from Global in USA, radial automatic plug-in system from TDK in Japan, dual-wave peak welding machine from Honghui in Japan, online test instrument from TESCON in Japan, sealing equipment and welding production line from MK in Japan, etc. svainfo.com |
薄膜工艺技术最初是由TDK开发并改进的,用来制造硬盘驱动的读/写磁头。 epcos.com | Thin-film process technology was originally [...] developed and refined byTDK for the manufacture [...]of read/write heads for hard disk drives. epcos.com |
根据薄膜技术,TDK智能手机设计的滤波和保护性能而开发了一款小型组合元件。 epcos.com | Based on [...] thin-film technology, TDK developedaminiature [...]combined component for the filtering and protection of smartphone designs. epcos.com |
由于薄膜元件的低剖面特性和结构紧凑的尺寸,它们同样非常实用用于集成模块,例如,用TDK的SESUB(内置于基板的半导体)技术。 epcos.com | With their low profiles and compact dimensions, thin-film components [...] are also ideal for integration in [...] modules, for example, in TDK’s SESUB(semiconductor [...]embedded in substrate) technology. epcos.com |
TDK-EPC成立于2009年10月1日,总部设在日本东京,是由TDK的电子元件事业部门与德国主要电子元件生产商爱普科斯集团及其附属机构(以下简称“爱普科斯”)合并产生的。 epcos.com | TDK-EPC was founded on October 1, 2009 from the combination of the electronic components businessof TDK andthe major [...] German electronic components [...]manufacturer EPCOS AG and its subsidiaries (EPCOS) and is headquartered in Tokyo, Japan. epcos.com |
由于在陶瓷介电材料薄层上建立薄膜导电层而获得的TDK薄膜工艺,Z-匹配电容器能够获得一个极其严密的容差,而且,新元件提供了6.8 GHz (2.2 pF)的优良高自谐振频率(SRF)。 epcos.com | Thanks to TDK’s thin-film process achieved by building up thin-film conductive layers on thin layers of ceramic dielectric material, Z-match capacitors achieve an extremely tight tolerance and, furthermore, the new components offer an excellent high self-resonant frequency (SRF) of 6.8 GHz (2.2 pF). epcos.com |
是下一代的光盘格式蓝光光盘共同开发的名称协会(BDA)的,一批世界领先的消费电子,个人电脑和媒体制造商(包括苹果,戴尔,日立,惠普,JVC,LG,三菱,松下,先锋,飞利浦,三星,夏普,索尼,TDK公司和汤姆森)。 acoolsoft.com | Blu-ray, also known as Blu-ray Disc (BD), is the name of a next-generation optical disc format jointly developed by the Blu-ray Disc Association (BDA), a group of the world's leading consumer electronics, personal computer and media manufacturers [...] (including Apple, Dell, Hitachi, HP, JVC, LG, Mitsubishi, Panasonic, Pioneer, Philips, [...] Samsung,Sharp, Sony, TDK andThomson). acoolsoft.com |
意法半导体欧洲中东和非洲区能源效率市场开发高级经理乌利奇•基兴伯格解释道:“我们的客户了解采用了合格的高性能TDK和爱普科斯产品的参考设计会在无任何进一步的设计努力的情况下可靠地工作。 epcos.com | Our customers know that reference designs qualified with [...] high-performanceTDK andEPCOS products [...]will work reliably without any further [...]design effort,” explains Ulrich Kirchenberger, Senior Market Development Manager, Energy Efficiency, EMEA Region, STMicroelectronics. epcos.com |
除了具备TDKTFSC定向耦合器的优越性能之外(图2),这款新型的薄膜元件-尺寸只有0.65 [...] × 0.50 × 0.25 mm³-比以前使用传统LTCC工艺(1.0 × 0.5 × 0.35 mm³)制造的元件明显更小更薄。 epcos.com | In addition to the superior [...] performance of theTDK TFSC directional [...]coupler (Figure 2), the new thin-film component – at [...]just 0.65 × 0.50 × 0.25 mm³ – is significantly smaller and thinner than the previous products that were made using the conventional LTCC process (1.0 × 0.5 × 0.35 mm³). epcos.com |
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