化学机械平坦化 Chemical-mechanical planarization

（重定向自Chemical mechanical polishing）

化学机械平坦化（英语：Chemical-Mechanical Planarization, CMP），又称化学机械研磨（Chemical-Mechanical Polishing），是半导体器件制造工艺中的一种技术，使用化学腐蚀及机械力对加工过程中的硅晶圆或其它衬底材料进行平坦化处理。

单词	Chemical mechanical polishing
释义	Chemical mechanical polishing 中文百科化学机械平坦化 Chemical-mechanical planarization （重定向自Chemical mechanical polishing）化学机械平坦化（英语：Chemical-Mechanical Planarization, CMP），又称化学机械研磨（Chemical-Mechanical Polishing），是半导体器件制造工艺中的一种技术，使用化学腐蚀及机械力对加工过程中的硅晶圆或其它衬底材料进行平坦化处理。英语百科 Chemical-mechanical planarization 化学机械平坦化（重定向自Chemical mechanical polishing） Chemical Mechanical Polishing/Planarization is a process of smoothing surfaces with the combination of chemical and mechanical forces. It can be thought of as a hybrid of chemical etching and free abrasive polishing.
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Chemical mechanical polishing