| 释义 |
bonding pressure
- pressurizationn. 增压(压紧；压力输送)
- correspondingadj. 相当的, 对应的 符合的, 一致的
- underrepresentedadj. 未被充分代表的
- superabundancen. 多余,剩余,过多
- 耦合力ǒu hé lì
bonding force
- 高血压gāo xuè yā
high blood pressure, hypertension
- 芯片焊接xīn piàn hàn jiē
chip bonding; die bonding; die attachment
- 电压diàn yā
pressure, tension, voltage
- 渗透压shèn tòu yā
osmotic pressure
- 剩余压力shèng yú yā lì
residual pressure; surplus pressure; excessive pressure
- 缝焊féng hàn
slit bonding
- 表压biǎo yā
gage pressure; manometer pressure
- 滞止压力zhì zhǐ yā lì
stagnation pressure
- 钻压zuàn yā
bit pressure; bit weight
- 大气压力dà qì yā lì
atmospheric pressure, barometric
- 低血压症dī xuè yā zhèng
low blood pressure
- 最大压差zuì dà yā chà
maximum differential pressure
- 键合jiàn hé
bonding; linking; linkage
- 交联jiāo lián
crosslinking; cross bonding
- 饱和蒸汽压bǎo hé zhēng qì yā
saturated vapor pressure
- 减压jiǎn yā
decompression; decompress; reduced pressure; reduce pressure
- 轮胎气压lún tāi qì yā
tyre pressure, tire pressure
- 释放压力shì fàng yā lì
release pressure; discharge pressure
- 许用工作压力xǔ yòng gōng zuò yā lì
allowable working pressure
- 紧迫jǐn pò
pressure
- 排放压力pái fàng yā lì
relieving pressure; discharge pressure; blowdown presssure
- 泄压装置xiè yā zhuāng zhì
pressure relief device; pressure relief apparatus
- 芯片焊盘xīn piàn hàn pán
chip bonding pad
- 粘合zhān hé
conglutinate; glue; adhesion; bonding; cohere
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