Tape-automated bonding

（重定向自Tape automated bonding）

Tape-automated bonding (TAB) is a process that places bare integrated circuits onto a printed circuit board (PCB) by attaching them to fine conductors in a polyamide or polyimide film, thus providing a means to directly connect to external circuits.

单词	Tape automated bonding
释义	Tape automated bonding 英语百科 Tape-automated bonding （重定向自Tape automated bonding） Tape-automated bonding (TAB) is a process that places bare integrated circuits onto a printed circuit board (PCB) by attaching them to fine conductors in a polyamide or polyimide film, thus providing a means to directly connect to external circuits.
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