The results show that polyetherimide toughen this resin system, but improve the dielectric performance.

研究表明,聚醚酰亚胺在改善氰酸酯树脂体系韧性的同时, 也提高了树脂体系的介电性能.

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The results show that the comprehensive properties of room temperature curing DAIP resin system are better.

结果表明:室温固化DAIP树脂体系具有较好的综合性能.

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The kinetic parameters and reactive mechanism of DAIP resin system in the presence TAC are studied.

本文主要研究了三聚氰酸三烯丙基酯(TAC)改性DAIP树脂 体系的固化反应参数以及反应机理.

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The curing reaction of modified bismaleimide resin system was measured with DSC —7 instrument of Perkin — Elmer Company.

用PERKIN—ELMER公司的DSC—7仪器测定了改性双马来酰亚胺树脂体系的固化反应.

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A new kind of bismaleimide resin system which can be aceton is prepared.

研制了具有良好溶液性质的双马来酰亚胺树脂体系的新方法.

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