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It is also introduced how to measure the powder particle distribution.
介绍了粉末粒度分布测试仪的操作.
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The specific platelet structure of the micro - powder particle, which ensure the high efficiency of lapping.
微粉颗粒特有的平板状结构, 保证研磨高效率.
It involves the considerations of alloy content, tin powder particle and soldering flux type.
选择锡膏要考虑的因素包括合金含量, 锡粉颗粒和助焊剂的因型.
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