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The mechanism of electroless nickel deposition in sodium hypophosphite bath is discussed.
探讨了次亚磷酸钠体系化学镀镍沉积机理.
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Electroless copper plating on PET fabrics using hypophosphite as reducing agent was investigated.
研究了采用次磷酸钠作还原剂在涤纶织物上化学镀铜.
The process of hypophosphite electrooxidation on a nickel electrode could be well simulated by this model.
结果表明,该模型能很好地模拟次亚磷酸根在镍电极上的电化学氧化过程.
次磷酸盐???
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