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The poor area of joint is interface between film conductor and ceramic.
接头的薄弱环节是膜导体与陶瓷基板的界面.
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Silver thick film conductor was fabricated directly on ceramic substrate by micro - atomization ( Microjet ) spraying deposition.
采用 微细 雾化喷射沉积直写的方法在陶瓷基板上制备银 厚膜 导体.
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