| 单词 | electronic packaging |
| 释义 | 例句释义: 电子电路组装,电子封装,电子组装,电子构装 1. To apply ceramic to electronic packaging substrate material depends on improvements of its micro-machining properties. 陶瓷用于电子封装基片材料，有赖于对其微细加工性能进行改善。 paper.pet2008.cn 2. The example of electronic packaging problem demonstrates that the proposed method is available and efficient. 电子封装问题的多学科协同满意优化实例表明该方法是行之有效的。 www.ceps.com.tw 3. The increase of chip integration and packaging density has set higher demands on properties of electronic packaging materials. 芯片集成度的增加及封装密度的增大都对电子封装材料的性能提出了更高的要求。 paper.pet2008.cn 4. The contents of nano electronic packaging, as well as its status and developing trend are described. 阐述了纳电子封装的研究内容和纳电子封装的现状及发展趋势。 www.ceps.com.tw 5. Strong fundamental in the fields of electronic packaging related mechanics and material science. 在封装相关的机械和材料方面基础知识扎实； hangzhou.jinti.com 6. With the change of material and technics in electronic packaging, it brings the problem of solder joint reliability. 由于封装材料与封装工艺的改变，给焊点可靠性带来了一系列相关问题。 www.dictall.com 7. Electronic Packaging Technology is new specialized field in Harbin institute of technology at present time. 哈尔滨工业大学新开设本科电子封装技术专业的专业课程《电子材料》课程。 m.qikan.com.cn 8. Chemical synthesis of high electrical conductivity polypyrrole film on the surface of electronic packaging materials 电子封装材料表面化学制备高导电率聚吡咯薄膜的研究 service.ilib.cn 9. Investigation on the Improvement of Toughness and Thermal Resistance of the Epoxy Resins Using for Electronic Packaging 电子封装用环氧树脂的增韧和提高耐热性研究 www.ilib.cn 10. Application of the New Material in High-Density Electronic Packaging and its Prospect 浅析新材料在高密度电子封装上的应用及发展前景 www.ilib.cn 1. Present Status and Progress in Study of Electronic Packaging Materials 电子封装材料的研究现状及进展 service.ilib.cn 2. The Application of Several Electronic Packaging Technologies in Portable Electronics Products 几种电子封装技术在便携式电子产品中的应用 ilib.cn 3. Electronic Packaging Technology and Polymer-based Composite Packaging Materials 高导热聚合物基复合封装材料及其应用 service.ilib.cn 4. Applications of electroplating technology in electronic packaging 电子封装中电镀技术的应用 www.ilib.cn 5. Thermal conductivity of high thermal conductivity composites for electronic packaging 高导热电封装复合材料界面热传导的扫描热显微镜分析 www.ilib.cn 6. Proceedings of the Second International Symposium on Electronic Packaging Technology 第二届国际电子封装技术会议论文集 mse.fudan.edu.cn 7. Recent Achievement in Research for Electronic Packaging Ceramic Substrate Materials 电子封装陶瓷基片材料研究现状 www.ilib.cn 8. Microstructures and properties of Si -Al alloy for electronic packaging prepared by spray deposition technique 喷射沉积硅铝电子封装材料的组织与性能 service.ilib.cn 9. Electronic packaging material system for semiconductor packages 半导体用封装材料系统 www.carreviews.cn 10. Recent achievements in research for electronic packaging substrate materials 电子封装基片材料研究进展 scholar.ilib.cn 1. New Spray Formed Light Weighted Si-Al Electronic Packaging Materials with Low Thermal Expansion and High Heat Conducting 新型喷射成形轻质、高导热、低膨胀Si-Al电子封装材料 scholar.ilib.cn 2. Design Guidelines for Electronic Packaging Utilizing High Speed Techniques 采用高速技术电子封装设计导则 z.tougao98.com 3. Dielectric Properties of Glass-ceramics Substrate for Electronic Packaging 电子封装微晶玻璃基板的介电性能 www.ilib.cn 4. Research on High Performance Novel Electronic Packaging Materials of Silicon-based Aluminum 新型硅基铝金属高性能电子封装复合材料研究 www.ilib.cn 5. Design of Pb-free solders in electronic packaging by computational thermodynamics and kinetics 电子组装无铅焊料的热力学、动力学计算及合金设计 www.ilib.cn 6. Effect of Annealing Technology on the Properties of Rolled Composite CPC Electronic Packaging Material 退火工艺对轧制复合CPC电子封装材料性能的影响 ilib.com.cn 7. NEPCON Texas Electronic Packaging and Production Exposition 电子封装与生产展 www.gbac.com.cn 8. Microstructure and properties of W-Cu electronic packaging materials by plasma spraying 等离子喷涂W-Cu电子封装材料的组织与性能 www.ilib.cn 9. Study on Thermal Expansion Property of High-silicon Aluminum Alloy for Electronic Packaging 电子封装用高硅铝合金热膨胀性能的研究 www.ilib.cn 10. Research Progress of Lead-free Solders and Solder Joint Reliability in Electronic Packaging 无铅电子封装材料及其焊点可靠性研究进展 www.ilib.cn 1. Components and Devices - Electronic Packaging 高级电子仪器组件 lib.bjpu.edu.cn 2. Experimental Methods for Electronic Packaging 微电子封装实验方法 wenwen.soso.com 3. Investigation of Partial Silver-Plating in Electronic Packaging 电子封装中的局部镀银研究 service.ilib.cn 4. Synthesis and properties of novel controlled thermally degradable epoxy resin for electronic packaging 新型可返工环氧底部填充料的合成和性能 www.ilib.cn 5. Processing Routes of Metal Matrix Composite for Electronic Packaging 电子封装用金属基复合材料的制备 service.ilib.cn 6. Research of rolling electroplate in electronic packaging 封装中的滚镀工艺研究 www.ichacha.net 7. International Journal of Microcircuits and Electronic Packaging 如微电路和电子封装国际期刊 www.cip.com.cn 8. Conformal Coatings for Electronic Packaging 用于电子封装的保形涂料 blog.sina.com.cn 9. Current Status of Research on Electronic Packaging Materials 电子封装材料的研究现状 service.ilib.cn 10. Recent Advances of Fillers in Epoxy Resin for Electronic Packaging Material 填料在环氧树脂基封装材料中的研究近况 www.ilib.cn 1. Review of Metal-Matrix Composite Materials for Electronic Packaging 金属基电子封装复合材料的研究进展 www.ilib.cn 2. Effect of Pressing Pressure on Properties of Si-Al Electronic Packaging Materials 压制压力对Si-Al电子封装材料性能的影响 service.ilib.cn 3. New Progress of Electronic Packaging Technology 电子封装技术的新进展 service.ilib.cn 4. Study on the Thermal Failure of Metal Substrates in Electronic Packaging 电子封装技术中金属基板结构的热失效行为研究 www.ilib.cn 5. Recent advances in the study of moisture absorption in plastic electronic packaging 吸收湿气对微电子塑料封装影响的研究进展 www.ilib.cn 6. Study on the Wettability of Lead-free Solders in Micro-electronic Packaging 微电子封装无铅焊料润湿性研究 service.ilib.cn 7. Failure Analysis on Electronic Packaging 电子封装失效分析 www.dcsimtech.com 8. The Global Market for Advanced Electronic Packaging 全球最新电子零件封装市场 www.giichinese.com.cn 9. Actuality and development of fatigue models of solder joints in micro-electronic packaging 微电子封装中焊点疲劳模型的现状和发展 www.ilib.cn 10. Recent Status of Research for Pb-Free Solders in Electronic Packaging 电子部件封装用无铅焊接材料的研究动态 www.ilib.cn 1. Laser Reflow in Electronic Packaging and Assembly 电子封装与组装中的激光再流焊 scholar.ilib.cn 2. Progress in epoxy resin for electronic packaging 电子封装用环氧树脂的研究进展 service.ilib.cn 3. Situation and Development of Epoxy Resins for Electronic Packaging 电子封装用环氧树脂的研究现状与发展趋势 www.ilib.cn 4. PM materials for electronic packaging 电子封装用粉末冶金材料 service.ilib.cn 5. The Present Situation of Lead-free System in Electronic Packaging 电子封装无铅化现状 www.ilib.cn 6. Recent Development of Lead-Free Solder in Electronic Packaging 电子封装用无铅焊料的最新进展 service.ilib.cn 7. HDEP High Density Electronic Packaging 高密度电子封装 www.bing.com 8. Chance and challenge of electronic packaging in China in 21 century 21世纪我国电子封装行业的发展机遇与挑战 www.ilib.cn 9. The development of materials and technology of electronic packaging 电子封装材料及其技术发展状况 service.ilib.cn |
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