| 单词 | electronic package |
| 释义 | 例句释义: 电子仪器组件,电子元件包膜,电子组件,电子构装,电子封装 1. With increase in electronic package density, the reliability of a board-level package under drop impact load becomes a key issue. 随着微电子封装密度的提高，板级封装在跌落冲击载荷下的可靠性成为人们关注的焦点。 www.dictall.com 2. With lead-free trend in electronic package, it is necessary to choose lead-free tin-base electrodeposits for electronics industry. 随着电子封装无铅化的趋势，选择无铅锡基镀层已成为必然。 www.ceps.com.tw 3. The electronic package is damaged - -Treatment method: Change the package. 电子组件损坏——处理方法：更换组件。 www.jxcad.com.cn 4. Development of advanced electronic package devices promoted the study on the reflow soldering. 先进电子封装器件的出现推动了再流焊方法和设备的研究。 www.dictall.com 5. Ceramic Particles (Fibers) Filled Polymer Composites Used for Electronic Package and Substrate 陶瓷颗粒（纤维）增强聚合物复合电子封装与基板材料 ilib.cn 6. Finite element numerical simulation analysis of electronic package subjected to thermal loading 电子封装件受热载荷作用有限元数值模拟分析 www.ilib.cn 7. Environment Protection Composite for Electronic Package 一种环保型电子封装用复合材料 www.ilib.cn 8. NEPCON: National Electronic Package and Production Conference 国际电子包装及生产会议 bbs.smt.cn 9. Fabrication technologies of solder ball for advanced electronic package 适用于先进电子封装的精密焊球制备技术 scholar.ilib.cn 10. Electronic Package Warpage Simulated with Numerical Method 电子封装器件翘曲问题的数值分析 ilib.cn 1. Research Status and Development of High Silicon Aluminium Alloy for Light Weight Electronic Package Materials 高硅铝合金轻质电子封装材料研究现状及进展 service.ilib.cn 2. In-situ Observation of Electronic Package during Heat Deformation 电子封装组件热变形的实时观测 www.ilib.cn 3. The Application of Heat Ultrasonic Bonding in the Electronic Package Field 热声焊机在电子封装业中的应用 www.ilib.cn 4. Key Issues of Micro-Electronic Package 对微电子封装中关键性问题的探讨 service.ilib.cn |
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