| 单词 | electroplating solution |
| 释义 | 例句释义: 电镀液 1. The invention relates to a nickel sulfamate electroplating solution which comprises nickel sulfamate, boric acid and nickelous chloride. 一种氨基磺酸镍电镀液，包括氨基磺酸镍、硼酸和氯化镍。 ip.com 2. Mainly discuss fluoroborate terne electroplating solution in use for PCB fabrication. 主要论述印制线路板生产中所用的氟硼酸盐镀锡铅溶液。 www.showxiu.com 3. The invention also provides a method for forming color plating by using the electroplating solution of the invention. 本发明还提供了一种使用本发明的电镀液来形成彩色镀层的方法。 ip.com 4. Simultaneous Determination of Iron and Palladium in Electroplating Solution and Electroplated Layer by First Derivative Spectrophotometry 一阶导数分光光度法同时测定记忆合金电镀液和电镀层中铁和钯 www.ilib.cn 5. Simultaneous Determination of Palladium and Cobalt in Electroplating Solution and Electroplated Layer by Spectrophotometry 电镀液和电镀层中钯和钴的分光光度法同时测定 www.ilib.cn 6. Combined Determination of Copper and Manganese in Electroplating Solution and Electroplated Layer by Spectrophotometry 电镀液和电镀层中铜和锰的联合测定 ilib.com.cn 7. Simultaneous Determination of Cobalt and Nickel in Tin-Nickel Alloy Electroplating Solution by Two- Wavelength Spectrophotometry 用双波长分光光度法同时测定锡镍合金镀液中的钴和镍 www.ilib.cn 8. Simultaneous Determination of Iron and Palladium in Electroplating Solution and Electroplated Layer of Palladium - Iron Alloy 钯铁合金镀液和镀层中钯和铁的同时测定 ilib.com.cn 9. Numerical Calculation of Coordination Compounds with Metal in Electroplating Solution 镀液中金属配合物定量计算 service.ilib.cn 10. Detection of Components of Electroplating Solution with Gradient Eluention Separation and Suppressed Conductance Detector 电镀液成分的梯度淋洗分离和抑制电导检测 www.ilib.cn 1. Gold Electroplating Solution for Electronic and Aerospace Applications 电子和宇航领域的镀金解决方案 wenku.baidu.com 2. Determination of Micro Chloride Ion in Acidic Copper Electroplating Solution by Turbidimetric 比浊法测定酸性镀铜液中微量氯离子 www.ilib.cn 3. Purification process of electroplating solution for bubble nickel production 泡沫镍生产中电镀液净化工艺 www.ilib.cn 4. Recycling Chromium From Waste Electroplating Solution 铜铬电镀废液中铬回收方法 www.ilib.cn 5. Determination of Tin, Copper, Lean in Electroplating Solution by Selective Chelatometry 选择性螯合滴定法测定电镀液中的锡铜铅 scholar.ilib.cn 6. The new method of continuously determinating copper and stannum in electroplating solution 测定电镀液中铜、锡的新方法 scholar.ilib.cn 7. Electroplating Solution of Imitated Rosy Gold 仿玫瑰金镀液的研究 www.ilib.cn 8. JHT serial activated carbon filters of electroplating solution 系列电镀溶液活性炭过滤机 tag.blog.sohu.com |
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