| 单词 | chip package | ||||||||||||||
| 释义 | chip package
更多释义 收起释义 例句释义: 芯片封装,晶片封装,晶片型封装 1. Based on the IBIS model, a simple method was proposed to estimate the simultaneous switching noise (SSN) of the high-speed chip package. 基于BIS模型，提出了一种新颖、简单地估算高速芯片封装结构同步开关噪声（SSN）的方法。 dictsearch.appspot.com 2. The rapid development of microelectronic technology has been giving impetus to the development of new chip package technology. 微电子技术的飞速发展也同时推动了新型芯片封装技术的研究和开发。 dictsearch.appspot.com 3. the fourth is enclosed, the antenna and a chip package, with the ability to read and write; 第四是封装，把天线和芯片封装到一块，能够读写； www.bing.com 4. The influence of underfill and its material models on the reliability of flip chip package under thermal cycling 底充胶及其材料模型对倒装焊热循环可靠性的影响 www.ilib.cn 5. The company was established in 1989, mainly design, manufacture chip package Dijiao; 本公司成立于1989年，主要设计、制造晶片封装滴胶； www.tonke.cn 6. Advanced Dielectric Materials for Chip Package Substrates 用于芯片级封装载板的绝缘材料 www.ilib.cn 7. Nonlinear finite element analysis on electronic chip package warpage 芯片电子封装翘曲非线性有限元分析 ilib.cn 8. Analysis and Suppression of Simultaneous Switching Noise in High-Speed Chip Package 高速芯片封装结构的同步开关噪声分析及抑制 www.ilib.cn 9. Chip Stress Analysis and Structure Optimization in Stacked Multi-Chip Package 多芯片叠层封装中的芯片应力分析及结构优化 www.ilib.cn 10. Study of he Process of the Flip Chip Package Based on Aluminum Nitride Substrate 以氮化铝陶瓷为基板的倒扣封装工艺研究 www.ilib.cn 1. Measuring Method in Thermal Strain of Flip Chip Package with Solder Joints 球栅阵列倒装焊封装中的热应变值的测试 www.ilib.cn 2. Using Time Series to Analyse and Predict Chinese Patent Data on Chip Package 时序法在芯片封装技术中国专利数据分析与预测中的应用 www.ilib.cn 3. CSP Causes the Revolution of Memory Chip Package Technology CSP引发内存封装技术的革命 www.ilib.cn 4. Developing Trend of Chip Package Technology 芯片封装技术的发展趋势 www.ilib.cn 5. Thermal Cycle Failure of SnPb Solder Joint for Flip Chip Package and Effects of Underfill Material 倒装焊SnPb焊点热循环失效和底充胶的影响 www.ilib.cn 6. Micro Crack Chip Package Chip Off Foot angle Coplanarity Touch Up 微裂缝崩角缺角，缺损成型角度共面性倒角 wenku.baidu.com 7. The Development of Memory Chip Package Technology 内存芯片封装技术的发展 service.ilib.cn |
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