| 单词 | copper plating |
| 释义 | 例句释义: 镀铜的,氧化亚铜,电镀铜 1. The influences of the intermediate and monomer brighteners commonly used in present acid copper plating on the hardness. . . 本文主要对目前国内外常见的酸性镀铜中间体、单体光亮剂对硬度的影响进行了测试研究。 dictsearch.appspot.com 2. In terms of cost management solution for high and low and the all things considered, sulfate copper plating is the vast majority of units. 根据本钱矮矮及溶液处置的不难难程度归纳思考，硫酸盐镀铜工艺被绝不小多数单元剥夺。 www.bing.com 3. A kind of composite additive used for copper plating of chemical replacement on iron surface was investigated. 研究了一种用于钢铁基体化学置换镀铜的专用复合添加剂。 www.chemyq.com 4. Production of copper plating technology commonly used by a copper with copper with coke, acid, phosphate copper with etc. 生产上常用的镀铜工艺有氰化镀铜、酸性镀铜、焦磷酸盐镀铜等。 www.hfsdm.cn 5. Copper plating, improve electricity with: render coating adhesion ability, and corrosion ability. 镀铜：打底用，增进电镀层附着能力，及抗蚀能力。 www.hfsdm.cn 6. The requirement of equipments for bright acid copper plating with sulfate bath is strict due to the specialties of the process. 硫酸盐光亮酸性镀铜，由于工艺的某些特殊性，对电镀设备要求很高。 lib.cqvip.com 7. copper plating the metal layer carved to RF element on substrate structure to form plating copper on antenna pattern. 对经过雕刻的成形在基体结构上的射频元件图形金属层进行铜电镀，在该天线图形上形成电镀铜。 ip.com 8. The process satisfies the demands of environmental protection and can replaces the cyanide copper plating for preve. . . 该工艺复合环保要求，可以取代防渗碳氰化镀铜工艺。 www.chemyq.com 9. A new copper plating bath for electroless deposition directly on conductive copper-diffusion barrier layers has been developed. 一种可以直接在传导性铜扩散阻挡层非电镀沉积的新的铜镀液已经被发现了。 ce.sysu.edu.cn 10. The effect of maleic acid, potassium ferrocyanide and thiourea on electroless copper plating was investigated. 研究了马来酸、亚铁氰化钾和硫脲对化学镀铜的影响。 paper.pet2008.cn 1. A novel technology of acidic electroless copper plating on steel matrix was studied in this paper. 研制了一种新型的钢铁基件酸性化学镀铜工艺技术。 www.dictall.com 2. Or harder version of lining on a layer of copper plating. 或者在较软的版衬上不放电镀一层紫铜即可。 www.bing.com 3. Is there a pre-startup checklist for the electrolytic copper plating line? Is it current(completely filled in)? 电镀制程启动是否有点检表？是否已经执行（完整的填写）？ www.6sq.net 4. Copper Plating: Copper is electrodeposited onto the copper foil that is outlined by the dry film. 镀铜：图形转移完成后将进行图形电镀。 blog.tianya.cn 5. Microanalysis of the Surface of Polyimide after each Pretreatment before Electroless Copper Plating 聚酰亚胺表面化学沉铜前处理的微观分析 service.ilib.cn 6. a plating step in which the substrate (1) is allowed to contact with a copper plating solution to form a copper plating film (2); 在稀硫酸处理工序后，使基材1与铜镀敷液接触而形成铜镀膜2的镀敷处理工序； ip.com 7. Direct Copper Plating Using Sodium Hypophosphite as Reductant on the Surface of Plastics 以次亚磷酸钠为还原剂的塑料直接镀铜 www.ilib.cn 8. Process Optimization of Replacement Copper Plating for Hydrogen-Storing Alloy and Its Electrochemical Behavior 贮氢合金表面置换镀铜工艺及电化学性能研究 service.ilib.cn 9. Influence of surfactants and polar organics on absorption spectrum and deposition rate of chemical copper plating solution 表面活性剂与极性有机物对化学镀铜的影响 service.ilib.cn 10. An Electrochemical Study of the Effects of Chelating Agents and Additives on Electroless Copper Plating 络合剂和添加剂对化学镀铜影响的电化学研究 www.ilib.cn 1. Study of the New Technique of Producing Copper Plating Wire in Chemical Method 化学法生产镀铜丝新工艺的研究 www.ilib.cn 2. The copper-plating steel wire stretching system wiredrawing lubricant performance optimization 镀铜钢丝拉拔系统拉丝润滑剂性能的优化 www.chinarubberchem.com 3. Influence of orthophosphate content on coating characteristic in pyrophosphate copper plating bath 焦磷酸盐镀铜液中正磷酸盐含量对镀层性能的影响 service.ilib.cn 4. Electroless Copper Plating of Non-Metallic Particles and Its Effects on Strength of Sintered Friction Materials 非金属颗粒镀铜及对烧结摩擦材料强度的影响 service.ilib.cn 5. Condition Study of Electroless Copper Plating for Nitrocellulose 硝基纤维素片化学镀铜工艺研究 xwskxyjs.nextage.cn 6. Comprehensive Utilization and Treatment of Chemical Copper Plating Effluent 化学镀铜废液的综合利用和处理 scholar.ilib.cn 7. Determination of chloride ions in acid copper plating bath by spectroanalysis of resonance light scattering 共振散射光谱法测定酸性镀铜液中的氯离子 www.ilib.cn 8. Research on mensuration of brightener content for bright acid copper plating by spectrophotometry 分光光度法测定酸铜光亮剂含量研究 www.ilib.cn 9. Chemical Analysis of Compositions of Displacement Copper Plating Solution 置换镀铜溶液成分的化学分析 www.ilib.cn 10. Development and Application of Bimetal Bush Sinter Technology without Copper Plating 双金属衬套无镀烧结新工艺的开发与应用 ilib.cn 1. Effect of Current Distribution on Coating Thickness of Acidic Copper Plating Cylindrical Articles 电流分布对圆柱件酸性镀铜层厚度的影响 www.ilib.cn 2. On the Quality of Raw Materials and Anode Used in Bright Acidic Copper Plating 酸性光亮镀铜的原材料和阳极的质量问题 www.ilib.cn 3. Determination of trace iron in acid copper plating solution with spectrophotometry 分光光度法测定酸性镀铜液中的微量铁 scholar.ilib.cn 4. Applications of copper plating technology to electronic materials 电镀铜技术在电子材料中的应用 www.ilib.cn 5. Selective Electroless Copper Plating Micro-pattern on Ceramics Without Sensitisation and Activation 陶瓷表面无敏化活化法微细化学镀铜 www.ilib.cn 6. Photometric Determination of Palladium in Gold-Palladium-Copper Plating Bath 金-钯-铜镀液中钯的光度测定 www.ilib.cn 7. Determination of copper sulfate in acid copper plating bath by spectrophotometry 酸性镀铜液中硫酸铜的光度测定 www.ilib.cn 8. Study and Applying of Uneven Welding Wire Producing Process of Chemical Displacement Copper- Plating 置换镀铜气保焊丝生产工艺研究 www.ilib.cn 9. Study of Brightener for Acidic Copper Plating 酸性镀铜光亮剂的研究 www.ilib.cn 10. Determination of Cl- concentration in sulfate copper plating solution 酸性光亮镀铜溶液中Cl-测定 www.ilib.cn 1. Consecutive Titration of Sulphuric Acid and Cupric Sulphate in Acidic Copper Plating Bath 酸性镀铜液中硫酸和硫酸铜的连续滴定 www.ilib.cn 2. Electrochemical Study on Electroless Copper Plating Using Sodium Hypophosphite as Reductant 以次磷酸钠为还原剂化学镀铜的电化学研究 service.ilib.cn 3. A Study of the Additives for Copper Plating 电镀铜系列添加剂的研究 www.ilib.cn 4. An Electrochemical Study of Electroless Copper Plating Using Glyoxylic Acid as Reducing Agent 乙醛酸化学镀铜的电化学研究 service.ilib.cn 5. Analytical determination and adjustment of chloride ion in acid copper plating bath 酸性镀铜镀液中氯离子的分析测定及调整方法 www.ilib.cn 6. Accurate Determination of Copper Sulphate in Sulphate Copper Plating Bath 硫酸盐镀铜液中硫酸铜的准确测定 www.ilib.cn 7. Electroless Copper Plating on Graphite Surface without Activation and Sensitization 石墨表面无敏化及活化的化学镀铜法 www.ilib.cn 8. The Solution Study of Electroless Copper Plating Using Nontoxic Glyoxylic Acid as Reducing Agent 环保型乙醛酸为还原剂的化学镀铜液的研究进展 service.ilib.cn 9. Preparation and Properties of Pd Colloids Catalyst for Direct Copper Plating 直接电镀用胶体钯催化剂的研制及性能 www.ilib.cn 10. Photometric Determination of Chloride Ion in Acidic Copper Plating Bath 酸性镀铜液中氯离子的光度测定 www.ilib.cn 1. Synergistic Effect of Chloride Ion and Copper Phthalocyanine in Acid Copper Plating 酞菁染料与氯离子协同效应在酸性镀铜中的作用 ilib.cn 2. Processing Technology of Electroless Copper Plating on Graphite Powder by Iron Powder and Formaldehyde 铁粉法与甲醛法在石墨粉表面化学镀铜的工艺对比 www.ilib.cn 3. Effects and Control of the Additives for Bright Acid Copper Plating 酸性光亮镀铜添加剂的作用及控制 www.ilib.cn 4. New process of alkaline non-cyanide copper plating for preventing carburization 防渗碳碱性无氰镀铜新工艺 www.ilib.cn 5. Principle, application and research prospect of electroless copper plating 化学镀铜原理、应用及研究展望 scholar.ilib.cn 6. Determination of chloride ions in acid copper plating bath by nephelometry 比浊法测定酸性镀铜液中的氯离子 www.ilib.cn 7. Measures for Increasing the Stability of Acidic Bright Copper Plating Bath 提高酸性光亮铜镀液稳定性的措施 service.ilib.cn 8. Cause and control of the formation of copper powder in acid copper-plating 酸性镀铜中铜粉产生的原因及控制 service.ilib.cn 9. Progress of Cyanide-Free Alkaline Copper Plating Technology 无氰碱性镀铜工艺的研究进展 www.ilib.cn 10. Non-cyanide alkaline strike copper plating process for zinc alloy die-castings 锌合金压铸件无氰碱性预镀铜工艺 www.ilib.cn 1. Process of Coarsening Pretreatment of Epoxy - Resin Packaging Material for Electroless Copper Plating 化学镀中环氧树脂封装材料粗化的研究 www.ilib.cn 2. Study on the Technology of the Electroless Copper Plating on the Stainless Steel Substrate 不锈钢基体上化学镀铜工艺研究 www.ilib.cn 3. Factors Affecting on Micro-levelling of Acidic Bright Copper Plating 影响酸性光亮镀铜层微观整平性的因素 www.ilib.cn 4. Photometric Determination of Iron in Acidic Copper Plating Bath 酸性镀铜液中铁的光度测定 service.ilib.cn 5. Analysis and Supplement of Chlorine-ion in Acidic Bright Copper Plating Bath 酸性光亮镀铜液中氯离子的分析和补充 service.ilib.cn 6. Rapid Determination of High Content Ferric Ion in Acidic Copper Plating Bath 酸性镀铜溶液中高量铁的快速测定 www.ilib.cn 7. Application of Pulse Power Source in Copper Plating on Printed Circuit Board 脉冲电源在印制电路板镀铜上的应用 service.ilib.cn 8. Technology for Copper Plating in a Novel Citrate Bath 新型柠檬酸盐镀铜工艺 service.ilib.cn 9. Additives and Brightening Agent for Acidic Copper Plating 新型酸性镀铜添加剂及光亮剂简介 www.ilib.cn 10. Acidic Copper Plating Technology of Printed Circuit Board 印制板酸性镀铜工艺 www.ilib.cn 1. Application of Modified Chitosan to Acidic Copper Plating 改性甲壳胺在酸性镀铜中的应用研究 www.ilib.cn 2. Troubleshooting for Bright Acid Copper Plating 光亮酸性镀铜故障处理 www.ilib.cn 3. Study on the Stability and Deposition Rate of Electroless Copper Plating 影响化学镀铜溶液稳定性和沉铜速率的因素 service.ilib.cn 4. Effect of Rare Earth Additive on Anticorrosion of Bright Acidic Copper Plating 稀土添加剂在光亮酸性镀铜中的应用 www.ilib.cn 5. Determination of Total Cyanide in Cyanide Copper Plating Bath 氰化镀铜液中总氰化物的测定 service.ilib.cn 6. Continuous copper plating on steel wire at high current densities 高电流密度连续生产钢芯镀铜线工艺 www.ilib.cn 7. Research on Pretreatment before Electroless Copper Plating 微孔沉镀铜前处理研究 www.pcbchinanet.com 8. Effect of copper plating process on tin layers before brazing aluminum alloy 镀铜工艺对铝合金钎焊前灌锡层的影响 www.ilib.cn 9. Alkaline copper plating of zinc alloy from cyanide-free solution 锌基合金碱性无氰镀铜 ilib.cn 10. Electroless copper plating on semiconductor silicon 半导体硅表面化学镀铜 www.ilib.com.cn 1. New Technology for Electroless Copper Plating in the Environment Protection 环保型化学镀铜新技术 www.ilib.cn 2. A Study of Bright Acid Copper Plating 酸性光亮镀铜工艺的研究 www.ilib.cn 3. Non-cyanide alkaline copper plating process on steel matrix 钢铁基体上碱性无氰镀铜 www.ilib.cn 4. Electroless Copper Plating Technology for Tungsten Powder 钨粉化学镀铜工艺研究 www.ilib.cn 5. Electroless Copper Plating Technology for Graphite Powder 石墨粉化学镀铜工艺的研究 www.ilib.cn 6. Determination of chloric ions in acidic copper plating 酸性硫酸铜镀液中氯离子的测定 www.ilib.cn 7. Progress of Additives for Acidic Bright Copper Plating 酸性镀铜光亮剂的发展 www.ilib.cn 8. The Influences of Additives on Hardness of Acid Hard Copper Plating 有机中间体对电镀酸性硬铜硬度的影响 www.ilib.cn 9. A study on Alkaline Cyanide-free Copper Plating Technology 碱性无氰镀铜工艺研究 www.ilib.cn 10. Application of Additives in Copper Plating of Carbon Fiber 添加剂在碳纤维镀铜中的应用 www.ilib.cn 1. Technology and Application of Electroless Copper Plating 化学镀铜及其应用 service.ilib.cn 2. Rapid Analysis of Copper Sulfate in Acidic Copper Plating Bath 酸性镀铜液中硫酸铜含量的快速分析 ilib.cn 3. Four Pieces of Factory Experiences for Copper Plating 镀铜现场经验四则 www.ilib.cn 4. In situ Investigation on the Behavior of Mixed Potential in Electroless Copper Plating 化学镀铜过程混合电位本质的研究 scholar.ilib.cn 5. Technical Development of Copper Plating Materials 镀铜工艺中基础电镀材料的技术发展及进步 www.ilib.cn 6. Copper plating on stainless steel pipe inner surface 不锈钢管内表面镀铜 www.ilib.cn 7. Condition Optimizing of Electroless Copper Plating for Glass Fiber 玻璃纤维化学镀铜工艺条件的优化研究 ilib.cn 8. Remedies for the Troubles in Acid Copper Plating 酸铜故障处理 service.ilib.cn 9. Design and implement method of high speed copper plating on steel tube 钢管高速镀铜的设计与实现方法 www.ilib.cn 10. One trouble shooting case in cyanide copper plating 氰化镀铜故障处理一例 service.ilib.cn 1. Blind Via Filling Process Using Copper Plating 采用电镀铜充填盲导通孔工艺 www.ilib.cn 2. Pretreatment of Carbon Fiber for Electroless Copper Plating 化学镀铜前碳纤维预处理的研究 scholar.ilib.cn 3. Causes of Burr Generation in Acidic Copper Plating 酸铜毛刺产生的原因 service.ilib.cn 4. Electroless Copper Plating on Graphite Powder Surface 石墨粉表面化学镀铜工艺研究 www.ilib.cn 5. Research progress on electroless copper plating 化学镀铜的应用与发展概况 www.ilib.cn 6. Study on technics of SiC composite powder electroless copper plating SiC粉体化学镀铜工艺研究 www.ilib.cn 7. Automatic Panel Copper Plating Line 自动整板镀铜线 wenku.baidu.com 8. High Speed Thick Copper Plating of Cylinders 圆筒高速电镀厚铜层 www.ilib.cn 9. Choice of Raw Material and Craft Maintenances in Acid Bright Copper Plating 酸性光亮镀铜的原材料选择及工艺维护 www.ilib.cn 10. Composite Chemical Copper Plating of ZnO and SnO 氧化锌、氧化亚锡的复合化学镀铜 www.ilib.cn 1. Study on Copper-Plating Process of Graphite Powder 石墨粉末化学镀铜研究 www.ilib.cn 2. Copper Plating on the Carbon Fiber Surface 碳纤维表面电镀铜 service.ilib.cn 3. Removal of Cl- Ions in Sulfate Copper Plating Bath 硫酸盐镀铜液中氯离子的去除 service.ilib.cn 4. Electroless copper plating on ceramics 陶瓷基上化学镀铜 scholar.ilib.cn 5. A process of non-cyanide alkaline copper plating 无氰碱性镀铜清洁生产工艺的研究 www.ilib.cn 6. An Example of Troubleshooting for Acid Bright Copper Plating 一例酸性光亮镀铜故障处理 service.ilib.cn 7. A New Process for Cyanide-Free Copper Plating 碱性无氰镀铜新工艺 www.ilib.cn 8. Research and Development of Electroless Copper Plating 化学镀铜的研究进展 www.ilib.cn 9. Rare copper plating gold Buddha 收来罕见的铜镀金佛 cgi.ebay.com.cn 10. Study on the New Process of No Cyanide Copper Plating 无氰电镀铜新工艺试验研究 www.ilib.cn 1. Development of Electroless Copper Plating 化学镀铜的进展 service.ilib.cn 2. The effect of additives on electroless copper plating on ceramic surface 添加剂对化学镀铜的影响 service.ilib.cn 3. Rare copper plating gold Kwan-yin 收来罕见的铜镀金观音 cgi.ebay.com.cn 4. Electroless copper plating on difficultly deposited substrates by using glyoxylic acid as reducing agent 难镀基材上乙醛酸作为还原剂的化学镀铜 www.ilib.cn 5. Review on Development of the Additives and Technology of Acid Copper Plating 酸性镀铜添加剂及其工艺的发展回顾 ilib.cn 6. New thought about solid wire used in automatic welding in Japan -Property of non-copper-plating solid wire used in MAG welding 日本关于自动焊接用实心焊丝的新思路——非镀铜MAG焊接用实心焊丝的特征 www.ilib.cn |
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