| 单词 | vias | ||||||||||
| 释义 | vias
更多释义 收起释义 例句释义: 过孔,通孔,过孔或贯穿孔 1. Every ground connections should have its own via, do not share vias if possible. 每个地走线都应有自己的过孔，过孔不能共用。 www.showxiu.com 2. Alternatively holographic mask or an array of micro lenses may be used to focus the laser beams to the vias to fill them with metal. 另外全息面具或者微透镜阵列，可用于集中的激光束的孔，以填补他们的金属。 www.1168818.cn 3. Experimental results show that, it is necessary to optimize timing directly instead of merely controlling the amount of vias and couplings. 实验结果表明：该算法比只控制通孔和耦合电容数量的层分配策略具有更大的优势。 www.ceps.com.tw 4. The vertical metal walls of the waveguide resonators are realized by closely spaced metal filled vias . 矩形波导共振腔的垂直金属壁是以金属连通柱列来等效。 dictsearch.appspot.com 5. The pads and vias of the sacrificial circuit substrate are placed (64) in vertical proximity to the excess solder of the circuit substrate. 该牺牲电路基板的焊盘和孔与该电路基板的多余焊料垂直接近地放置（64）。 ip.com 6. The problem was solved by preparing the boards where the vias were filled before mounting the components. 这个问题是解决了筹备委员会的通孔在安装之前，已填补的组成部分。 learning.zhishi.sohu.com 7. All of the shield components are "stitched" together at regular intervals using vias. 所有的盾成份都在固定的间隔一起是“一针”使用经由。 www.erji.net 8. Attempting to clean out the vias can result in damage to the via, solder mask or PCB. 而试图将焊料吸出通孔，又可能导致通孔、焊接掩膜或PCB的损坏。 dictsearch.appspot.com 9. EPBGA model consists of seven parts, they are heat spreader, molding compound, chip, substrate, thermal vias , solder ball and PCB board. EPBGA构装体由七个部分所组成，分别为散热板、成形树脂、晶片、基板、热通孔、锡球及印刷电路板。 dictsearch.appspot.com 10. vias, along the edges of the guard trace. 焊、的边缘守卫的痕迹。 learning.zhishi.sohu.com 1. Themal reliefs are sometimes also used on vias very near, or in, pads of SMT components for the same reason. 基于同样的原因，限热槽也用于贴片元件内或离元件很近的焊盘。 blog.21ic.com 2. VIAS? Voice Interference Analysis Set? 语音干扰分析装置？。 www.scientrans.com 3. Surface mounting on boards with vias embedded in pads. 表面安装的板孔中嵌入垫。 learning.zhishi.sohu.com 4. Filling High-Density High Aspect Ratio Vias and High-Volume Production Setting 充填高密度高厚径比导通孔和大量生产装置 www.ilib.cn 5. Modeling and Analysis of Vertical Vias in High Speed Printed Circuit Board 高速印刷电路板间垂直通孔的建模与分析 www.ilib.cn 6. The Technology of Tin Plating In Micro Blind Vias 浅谈微盲孔电镀锡工艺控制 www.ilib.cn 7. Plating High Aspect Ratio Blind Vias 高厚径比盲孔电镀 www.ilib.cn |
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