| 单词 | wafer bonding | ||||||||||||||||
| 释义 | wafer bonding
更多释义 收起释义 例句释义: 晶圆键合,晶片键合,晶圆接合 1. Finally, by combining wafer bonding technology with other processes, a micro fluidic chip for hemocytometer is prepared. 最后，将多种工艺结合，制备了血细胞计数器的微流体分析芯片。 soso.361xs.com 2. According to the present invention, defects of traditional wafer bonding process can be avoided. 本发明可避免传统晶片粘合工艺的缺点。 ip.com 3. Low Temperature Wafer Bonding Technology and Its Applications to Telecommunications Optoelcetronic Devices 低温晶片键合技术及在通信光电子器件中的应用 ilib.cn 4. An Investigation into the Thinning Induced Stress in Wafer-to-Wafer Bonding and Its Effect 硅-硅键合晶片在减薄过程中产生的应力及影响 168.160.184.78 5. Wafer Bonding Technology and Its Applications in Vertical Cavity Devices 晶片键合技术及其在垂直腔型器件研制中的应用 ilib.cn 6. Integration and Packaging of Sensors and MEMS Devices Through Low Temperature Wafer Bonding 用低温圆片键合实现传感器和微电子机械系统器件的集成和封装 ilib.cn 7. Investigation of the Wafer Bonding Interface in Room Temperature with the Elasto-mechanics Theory 室温晶片键合界面的弹性理论分析 service.ilib.cn 8. Analysis of Interfacial Dislocations of Wafer Bonding by the O-lattice Model 利用O点阵模型对键合界面位错特性的分析 www.ilib.cn 9. Research Advances and Applications in Wafer Bonding Technology 键合技术的研究进展及应用 ilib.cn 10. Effect of Wafer Surface Morphology Characteristics on Wafer Bonding 晶片表面几何特性对键合的影响 service.ilib.cn 1. Realization of Testing Wafer Bonding Quality with Cold Light Source 冷光源检测晶片键合质量的实现 ilib.cn 2. Measurement Research of Wafer Bonding Strength 圆片键合强度测试方法分析 www.ilib.cn 3. Measurements of the Bond Strength for Wafer Bonding 硅片键合强度测试方法的进展 www.ilib.cn 4. Measurement System for Wafer Bonding Strength 硅片键合强度测试系统研究 scholar.ilib.cn 5. Induction heating of gold film on silicon substrate for wafer bonding 感应加热硅衬底上的金膜用于圆片键合 www.ilib.cn 6. Research Advances in Wafer Bonding Technique of GaN Material GaN材料键合技术研究进展 ilib.cn 7. Investigation on Au-Si wafer bonding for MEMS device packaging 用于MEMS器件芯片级封装的金-硅键合技术研究 ilib.cn 8. IR System for Detecting Wafer Bonding Quality 晶片键合质量的红外检测系统设计 www.ilib.cn 9. Si-Si Wafer Bonding with Glass Intermediate Layer 玻璃中介硅圆片键合研究 service.ilib.cn 10. Research of Technique for Wafer Bonding 圆片键合工艺研究 ilib.cn 1. Membrane Transfer by Wafer Bonding 利用键合方法转移薄膜材料 ilib.cn 2. Timing Test for Picking Up of Wafer Bonding Machine 硅片焊接机拾起硅片时序测定方法 www.ilib.cn |
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