| 单词 | tin-plating |
| 释义 | 例句释义: 镀锡,电镀锡,镀氮化钛 1. The invention relates to a piston ring and a surface spongy tin plating technique thereof. 一种活塞环及其表面松孔镀锡工艺。 ip.com 2. Before or tin plating nickel plating of bad contacts between the cathode, discharge sparks will melt into hollow copper hole. 镀镍前或锡电镀间的阴极接触不良，放电火花将铜材熔成凹洞。 www.hfsdm.cn 3. Operating hints and safety requirement of re melting in crystal pattern tin plating were introduced. 介绍了晶纹镀锡中重熔工序的操作要点和安全要求。 www.dictall.com 4. A new method for the determination of sodium stannate in alkaline tin plating baths was advanced. 提出了一种新的测量碱性镀锡液中锡酸钠含量的方法。 www.chemyq.com 5. Tin plating as early as 1843 puts forward the first patent, and after 1930 have industrial practical. 电镀锡早在1843年就提出了第一个专利，1930年之后才具备工业实用性。 www.hfsdm.cn 6. In conjunction to expand our service network throughout the world, we obtained license in double tin plating process in Japan recently. 同时积极拓展全球化服务网络，我们的纯锡电镀双层工艺更在日本获取专利。 www.sfchina.net 7. S conductor material: many strands of fine twisted into a bundle superfine tin plating copper conductor naked; 导体材料：多股精绞成束超细镀锡裸铜丝导体； www.qy6.com 8. Benzylidene acetone desorption potential acid sulfate tin plating solution is very close to the ideal of the desorption potential; 苄叉丙酮的脱附电位很接近酸性硫酸盐镀锡溶液的理想脱附电位； zhidao.baidu.com 9. Prevention and elimination of hydrogen embrittlement produced during tin plating of elastic articles 弹性零件镀锡氢脆的预防及消除 service.ilib.cn 10. Exploration of Selecting the Stabilizing Agent in Tin-Plating Solution bv Methods of Electric Potential Difference 电位差法遴选酸性锡基镀液稳定剂的初探 www.ilib.cn 1. Electrochemical Oxidation of Organic Additives in Tin Plating Electrolytes 镀锡电解液中有机添加剂的电化学氧化 www.ilib.cn 2. Tin Plating Protective Technology in Production of Multilayer Printed Circuit Board 多层印制板生产中的电镀锡保护技术 service.ilib.cn 3. Forming Mechanism of the Oil Contaminants in High Speed Tin Plating Electrolyte 高速镀锡液中油污的形成机理 www.ilib.cn 4. Effects of the Technological Conditions of Low Temperature Electroless Tin Plating on the Thickness of Tin Coating 低温化学镀锡工艺条件对锡层厚度的影响 www.ilib.cn 5. Evaluation Technique and Countermeasure for Tin Whisker Risk of Tin Plating Components 元器件纯锡镀层表面晶须风险评估与对策 www.ilib.cn 6. Trial Application of Potassium Chloride Zinc Plating Additive to Acidic Bright Tin Plating 钾盐镀锌添加剂在酸性光亮镀锡中的试用 www.ilib.cn 7. A Study of SS Series Additives for Acidic Bright Tin Plating SS系列酸性光亮镀锡添加剂的研究 www.ilib.cn 8. Itinerant Inspection of Tin Plating Production Line for Copper Coated Steel Wire 镀铜钢丝镀锡生产线中的巡回检查 www.ilib.cn 9. Treatment of Chromium Containing Wastewater from Tin Plating on Sheet Steel 薄钢板镀锡含铬废水处理 ilib.cn 10. A new method for the determination of sodium stannate in alkaline tin plating baths 一种新的测量碱性镀锡液中锡酸钠含量的方法 www.ilib.cn 1. Research Progress of the Stability of Acid Tin Plating Solution 酸性镀锡液稳定性的研究进展 www.ilib.cn 2. Sulfate Satin Pure Tin Plating Process Used in PCB 硫酸盐型亚光纯锡电镀工艺在PCB上的应用 www.ilib.cn 3. Trouble shooting cases in tin plating process for exo-wire of black ceramics sealed IC 黑瓷封装IC外引线镀锡后连锡短路的故障处理 www.ilib.cn 4. Maintenance and Management for Acidic Bright Tin Plating Bath 酸性光亮镀锡溶液的维护与管理 www.ilib.cn 5. Study of Iron Impurity Removal by TTHA in High- Speed Tin Plating 三乙四胺六乙酸消除高速镀锡液中铁杂质影响的研究 www.ilib.cn 6. Studies on the antioxidation of rare earth catalyst in acid tin plating bath 稀土催化剂抗酸性镀锡液氧化变质的研究 service.ilib.cn 7. Research process on electroless tin plating reaction mechanism 化学镀锡反应历程的研究进展 www.ilib.cn 8. Effect of Additives in Electroless Tin Plating Bath on Electrode Process and Coating Properties 化学镀锡液中添加剂的影响研究 ilib.cn 9. Optimization of the Process Conditions of Electroless Tin Plating 化学镀锡工艺条件的优化 www.ilib.cn 10. Technology for Electroless Tin Plating at Ambient Temperature 常温化学镀锡工艺 www.ilib.cn 1. Determination of free sulfuric acid in acid tin plating bath 酸性镀锡液中游离硫酸的测定 service.ilib.cn 2. Barrel Bright Tin Plating Technology 滚镀光亮锡工艺 scholar.ilib.cn 3. Trouble Shooting of Tin Plating for Large Products 大件镀锡故障的排除 www.ilib.cn 4. Tin Plating--An Important Measure for Leak Stopping 镀锡--堵漏的重要手段 www.ilib.cn 5. An Investigation of Electroless Tin Plating on Copper Substrate 铜基上化学镀锡工艺研究 www.ilib.cn 6. Bright Tin Plating on Al and Its Alloys 铝及铝合金光亮镀锡 www.ilib.cn 7. Some Problems in Lead- free Pure Tin Plating Process 无铅纯锡电镀中的若干问题 www.ilib.cn 8. Instability of Acidic Tin Plating Bath 酸性镀锡液不稳定性研究 www.ilib.cn 9. High Dispersal Bright Acid Tin Plating for PWB 用于PWB的高分散能力光亮酸性镀锡 www.ilib.cn 10. Research Progress of Tin Whisker in Electroless Tin Plating 化学镀锡晶须的研究进展 www.ilib.cn 1. New Process for Electroless Tin Plating Using Catalyst 采用催化剂的化学镀锡新工艺的研究 www.ilib.com.cn 2. The Technology of Tin Plating In Micro Blind Vias 浅谈微盲孔电镀锡工艺控制 www.ilib.cn 3. Study on Porosity of Electroless Tin Plating Coatings 化学镀锡层孔隙率研究 www.ilib.cn 4. Development of additives for bright tin plating 光亮镀锡添加剂的开发 service.ilib.cn 5. Probe into New Process of Electroless Tin Plating on Copper Substrate 铜基上化学镀锡新工艺初探 www.ilib.cn 6. A Research on Acidic Bright Tin Plating 酸性光亮镀锡工艺的研究 www.ilib.cn 7. Antitarnishing of bright tin plating on copper wire 铜线材防变色光亮锡电镀工艺 www.ilib.cn 8. Lead Free Plating Pure Tin Plating 无铅电镀纯锡电镀 wenku.baidu.com 9. Current study status and development of electroless tin plating for PCB 印制线路板中化学镀锡研究现状与发展 www.ilib.cn 10. A Study on Process of Electroless Tin Plating on Flake Copper Powder 片状铜粉化学镀锡的工艺研究 www.ilib.cn 1. Tin Plating for Milk Barrel 奶桶电镀锡 www.ilib.cn |
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