solder joint

Subsequent inspection under magnification identified three solder joint which appeared to have melted and resolidified (see below).

New developments in flux chemistries for lead-free pastes do not require nitrogen to achieve good wetting and solder joint integrity.

2-D X-ray cannot be used on double-sided boards unless each solder joint is in a unique location relative to the opposite side of the board.

The experiment results show that there is linear relationship between the solder joint creep damage and its resistance changes.

One of the best predictors of resultant solder joint integrity is the volume of solder paste that was applied earlier in the process.

The hardware used for solder joint image imaging and acquisition was adopt to come true based on X ray imaging technology.

Saponifier formulations, without proper inhibitors, may attack some metal surfaces, resulting in a dull solder joint.

There are magnetic leakage inside tube with a strong magnet. Make use of small signal can intersect position of solder joint.

The board defect of the circuit measuring includes two parts: The solder joint defect measuring and measuring of the components and parts.

more than one-spot, high efficiency, consistency, and high strength welding, solder joint appearance, simple operation.

The results show that the residual moisture within underfill materials enhances the stress level in solder joint.

On the basis of this theory, SMT solder joint quality fuzzy diagnosis technology was studied.

Not only look better, and that it is important that the pads higher accuracy and results in increased solder joint reliability.

Secondly, the radiance model of the illuminator and the irradiance model of the solder joint are developed.

The digital processing algorithm suitable to solder joint image of the guided missile half tubes has been pressed.

c. Solder joint was exposed to excessive vibration of movement during the cooling phase.

With the change of material and technics in electronic packaging, it brings the problem of solder joint reliability.

Transition fittings are available for adapting to new or existing threaded or solder joint ends.

Ball valves threaded, socket-welding, solder joint, grooved and flared ends.

The mechanics of making both the solder joint and the brazing joint are comparatively similar.

The software which was adopt to come true based on image processing used for solder joint image processing and quality judgement.

The solder will be dull looking and, if the gold content in the solder exceeds about 5%, the solder joint will be brittle.

No cold solder joint, solder skips and wrong welding of components.

MSS SP-110 Covers Ball Valves, Threaded, Socket-Welding, Solder Joint, Grooved and Flared Ends.

Finite element based solder joint fatigue life predictions for a same die stacked chip scale ball grid array package

Life Prediction for Solder Joint Interconnect in the Package--Strain Energy Density Methodology and Effective Strain Methodology

Shape Prediction of BGA Solder Joint and Its Reliability Optimization Design

Reliability study of BGA mixed solder joint under thermal cycle

The Statistical Analysis and Optimal Evaluating on Thermal Fatigue Life of CCGA Based on Solder Joint Shapes

Effects of thermal cycle parameters and substrate dimensions on solder joint reliability

Research Progress of Lead-free Solders and Solder Joint Reliability in Electronic Packaging

Simulation of Three-Dimensional Shape of Solder Joint in Optical Fiber Attachment Soldering

The Technology of SMT Solder Joint Quality Automatic Testing and Intelligent Detecting

Random Fatigue Semi - experimental Model of SMT Solder Joint in Random Vibration Condition

Failure Analysis and Improvement of Solder Joint under Ultrasonic Vibration

Effects of Stand-off Height between Chip Component and Substrate on Lead-free Solder Joint Reliability

Reliability Analysis of Backwards Compatible Mixed Solder Joint

Dynamic Study of Lead-free Solder Joint under Drop Impact

Affects of Low Thermal Expansion Coefficient under fill on Reliability of Flip Chip Solder Joint

The Orthogonal Experiment and Regression Analysis of PBGA Solder Joint Thermal Life

Overview on Two Types of Ceramic Array Package and Their Solder Joint Reliability

Reliability analysis of forwards compatible solder joint

SMA Solder Joint Analysis and Test Center of Sun East Electronic Technology (Holding) Co. Ltd

Effect of Cu Surface Finishes of Printed Circuit Board on the Microstructure of Lead - Free Solder Joint

Wrought copper and wrought copper alloy solder joint drainage fittings - DWV

Automatic Management System of Solder Joint Reliability in Reflow Soldering

Optimization Design of Astronomic PBGA Solder Joint under Shock Load

Nitrogen Protection's Effect on Solder Joint Appearance in Lead-free Reflow Soldering

SMT project Known issues and difficulties Cold Solder Joint (dull joint)

Effects of Aging and Thermal Cycling on the Microstructure and Shear Strength of SnAgCu Surface Mount Solder Joint

Thermal stress analysis and fatigue life prediction for solder joint of SCSP

Numerical Analysis for Effect of Gas Hole Location on SMT Solder Joint Thermal Fatigue Life

Finite Element Analysis for Flip Chip Solder Joint Reliability

Shape prediction and reliability analysis of EBGA solder joint

Modeling and Predicting of Solder Joint Shapes of Fine Pitch Technology

Formation Mechanism of BGA Void and Effects on Solder Joint Reliability

Vibration Fatigue Life Prediction Model for Flip Chip Solder Joint

Shape prediction and reliability analysis of QFP solder joint

The Theory and Experiment Researches about The Solder Joint Reliability on PCB

Study on SMT Solder Joint Quality Fuzzy Diagnosis Technology Based on the Theory of Solder Joint Shape

Cast Copper Alloy Solder Joint Drainage Fittings - DWV

Impact of Reflow Parameter on Solder Joint Reliability

Overview on Solder Joint Reliability in Micro-jointing

Primary matter and quality evaluation to lead-free solder joint

CAD Solder Joint Shape Evolving and Reliability CAD of SMT Solder Joint

Lead-Free Solder-Joint Reliability Tests and Data Analysis

Finite Element Analysis on Solder Joint Stress of BGA under Shock Load

Research of Effect of Cooling Rate on Lead- free Solder and Solder Joint Quality

Thermal Cycle Failure of SnPb Solder Joint for Flip Chip Package and Effects of Underfill Material

Solder Joint Reliability of Plastic Ball Grid Array Component Based on Design of Full Factorial Experiment

Random Fatigue Semi-empirical Model of SMT Solder Joint

Research on Lead-Free Solder Joint Reliability

Thermal Fatigue Failure Analysis of SnPb Solder Joint in Flip-Chip Assemblies

Analyse of the Failure Mode of Solder Joint

Creating Solder Joint Reliability with SnCu Based Solders

Quality and Reliability of Solder Joint

The reliability of Lead-free Solder Joint

when welding to prevent cold solder joint, wax tumors to shave

Dimension of Solder Joint Ends

Analysis of SnPb solder joint strain and stress in flip-chip

Reflow Time above 230C for solder joint: Minimum 10s

Impact of Prefer Material Mode on the life-analyzing of SMT solder joint