| 单词 | solderable |
| 释义 | 例句释义: 可焊的,可软焊,焊接能力,可焊接 1. A uniform , compact , bright and excellent solderable coating with good adhesion was obtained by the experimental electroplating. 经小槽电镀，获得外观致密均匀、似镜面光亮、结合力强、具有优良的可焊性镀层。 www.chemyq.com 2. The bath components and the operating conditions for a new electroplating technology of solderable bright Sn-Bi alloy were studied. 研究了一种可焊性光亮锡铋合金电镀工艺的镀液配方和电镀操作条件； www.chemyq.com 3. Electroless nickel under immersion gold (ENIG) provides a solderable coating , but is expensive . 浸金下无电镀镍（ENIG）涂层可以提高可焊性，但此方法比较昂贵。 www.bing.com 4. Develop: The unexposed PISM is developed away, leaving the solderable pads exposed. 显影：未曝光的部分阻焊膜显影时除去，已曝光部分留存。 blog.tianya.cn 5. Specifications for particular types of winding wires - Solderable polyurethane enamelled round copper wire, class 155, with a bonding layer 特种绕组线规范.155级带粘结层的可焊接聚氨酯漆包圆铜线 www.mapeng.net 6. Electroplating processes of solderable coatings from methanesulfonate bath 甲基磺酸盐镀液体系可焊性合金镀层的工艺 scholar.ilib.cn 7. Surfaces of dense ceramic components for electrical engineering; testing of hard-solderable metal coatings 电工细陶瓷件的表面.可硬钎焊金属镀层的试验 www.mapeng.net 8. Surfaces of dense ceramic components for electrical engineering; testing of soft-solderable metal coatings 电工细陶瓷件的表面.可软钎焊金属镀层的试验 www.mapeng.net 9. Specifications for particular types of winding wires - Solderable polyurethane enamelled round copper wire, class 155 特种绕组线规范.155级可焊接聚氨酯漆包圆铜线 www.mapeng.net 10. Specifications for particular types of winding wires - Solderable polyurethane enamelled round copper wire, class 180 绕组线特殊类型规范.可焊接的聚氨酯漆包圆铜线.180级 www.mapeng.net 1. Standard Test Method for Measuring Adhesion Strength of Solderable Films to Substrates 测量可焊膜与基片的粘结强度的方法 www.ichacha.net 2. Specifications for particular types of winding wires - Solderable polyesterimide enamelled round copper wire, class 180 特种绕组线规范.180级可焊接聚酰胺酯漆包圆铜线 www.mapeng.net 3. Specifications for particular types of winding wires - Part 51: Solderable polyurethane enamelled round copper wire, class 180 特种绕组线规范。第51部分：钎焊聚氨酯漆包圆铜线180级 www.sungtek.com 4. Review and Prospect of Solderable Tin-Based Binary Alloy Plating 可焊性锡基二元合金镀层研究的现状与展望 www.ilib.cn 5. Research and Progress of Lead-free Solderable Tin-Based Coating 无铅可焊性锡基镀层的研究与发展 www.ilib.cn 6. Developing Status of Solderable Sn Alloy Plating 电镀可焊性锡合金工艺的发展现状 www.ilib.cn 7. Specifications for particular types of winding wires - Part 20: Solderable polyurethane enamelled round copper wire, class 155; Amendment 2 特种绕组线规范。第20部分：可焊接的聚氨基甲酸乙酯漆包圆铜绕组线，155级。修改件2 www.std168.com 8. Review of tin and solderable tin alloy electroplating 电镀锡和可焊性锡合金发展概况 www.ilib.cn 9. Progress of research on electroless plating of solderable tin alloy 化学镀可焊性锡基合金的研究进展 service.ilib.cn 10. Talk on Plating Process of Solderable Bright Sn-Ce Alloy 浅谈可焊性光亮锡铈合金电镀工艺 www.ilib.cn |
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