silicon wafer

I went into a clean room with a fresh silicon wafer, and then I just cranked away at all the big machines for about 100 hours.

Chip: The individual circuit or component of a silicon wafer, the leadless form of an electronic component.

Contamination Particulate - Particles found on the surface of a silicon wafer.

The surface grinding temperature of the silicon wafer ground by diamond wheels is studied.

The differential microphone is formed using silicon fabrication techniques applied only to a single, front face of a silicon wafer.

The final Ic is made by sequentially transferring the features from each mask, level by level, to the surface of the silicon wafer.

and a plurality of column holes are formed in the silicon wafer platform for leading the telescopic vacuum columns to penetrate through.

The silicon wafer comprises a silicon substrate, an insulating layer, at least one electric element and at least one perforating hole.

The invention provides a silicon wafer cross-connecting device and a silicon wafer cross-connecting method thereof.

Researchers took a 200-millimeter silicon-wafer chip and drilled a 3-nanometer-wide hole (known as a nanopore) through it.

The invention discloses a silicon wafer with perforating holes and a manufacturing method thereof.

A silicon wafer chip manufacturer tries to close a deal with a solvent service company.

Contamination Area - An area that contains particles that can negatively affect the characteristics of a silicon wafer.

The accommodating buffer layer is lattice matched to both the underlying silicon wafer and the overlying monocrystalline material layer.

A disruption in silicon wafer production can then stall makers of memory chips and, ultimately, consumer products.

Lab 1 apparatus: hot plate heater with silicon wafer (right), connected to a temperature probe (left).

ZHANG Y X. Study on surface layer damage in monocrystalline silicon wafer induced by ultra-precision grinding[D].

The new device is a silicon wafer about the shape and size of a playing card.

YMS-50 Laser cutting machine special used in cutting for solar cell and semiconductor silicon wafer.

Using silicon wafer as substrate makes compatibility with IC technology possible.

The silicon wafer is tacked with tiny pillars that catch abnormal cells that are, in the end, potentially cancerous.

The microscope comprises a silicon wafer filter membrane which is highly- planar and does not fluoresce.

Such being the case, the bare silicon wafer CMP has progressed toward planarization polishing or CMP for LSI devices.

Base Silicon Layer - The silicon wafer that is located underneath the insulator layer, which supports the silicon film on top of the wafer.

Research progresses in recent 10 years in metallic microcontamnation of silicon wafer during wet cleaning are briefly reviewed.

The micro machinery commonly is formed by a semiconductor substrate such as a silicon wafer.

Making integrated circuits involves depositing layers of materials such as semiconductors and metals on a silicon wafer.

Hot plate with silicon wafer lowered to heating position.

I was working for silicon wafer manufacturing of Semiconductor for 25 years and then quit this company.

Test Wafer - A silicon wafer that is used in manufacturing for monitoring and testing purposes.

A chip , on the other hand, is a silicon wafer that a core resides on.

Front Side - The top side of a silicon wafer. (This term is not preferred; use front surface instead. )

Calculation and analysis of light scattering and differential scattering cross section from a spherical particle on silicon wafer

Study of Silicon Wafer Cleaning Effects Using Clean Solutions Containing Surfactants and Chelates

The Chemical Corrosion for Silicon Wafer and Its Application in Power Semiconductor Devices

Calculation of Light Scattering from a Spherical Particle on a Silicon Wafer

Recent Progress in Study on Material Removal Mechanisms of Silicon Wafer During Chemical Mechanical Polishing

the silicon wafer receiving hand is built in the base platform and positioned below the silicon wafer cross-connecting region;

Investigation on Adsorption State of Surface Adsorbateon Silicon Wafer

Progress of Aqueous Solution Cleaning Technology for Silicon Wafer in VLSI Circuit Fabrication

Dissolution at High Temperature and Re-Growth of Oxygen Precipitation in Czochralski Silicon Wafer

A study of technique for cleaning polished silicon wafer

Chemical Effect Mechanism in Chemical Mechanical Polishing for Silicon Wafer

A plane polishing technology for silicon wafer with even contact pressure distribution

Photoluminescent Zinc Silicate Films Prepared on Silicon Wafer by Solid-Phase Reaction

Research on Surface Topography of Silicon Wafer in Chemical-mechanical Polishing

the silicon wafer receiving hand comprises a plurality of telescopic vacuum columns;

Ultrasonic Cleaning Technology of Grinding Silicon Wafer

Development Status of Ultra-precision Grinding Machine for Silicon Wafer

Recent progress in metallic microcotamination of semiconductor silicon wafer

Precision Nanometrology of Large Silicon Wafer Flatness

Chemical Mechanical Polishing for Silicon Wafer Planarization by Exerting Partial Region Load

Present Status of Ultra-Precision Machining Technology of Silicon Wafer

Sticking Behavior of Acidic and Basic Compounds in Clean Room Air onto Silicon Wafer Surface

Self-assembly of Silica Photonic Crystals Inside Micro-channel on Silicon Wafer

Development on the Microroughness of Polished Silicon Wafer

Effect of Nitrogen on Oxygen Precipitate Profile in Czochralski Silicon Wafer

A Modified Indicial Method of Sheet Resistance and Uniformity for Silicon Wafer

Chemical Corrosion on the Mechanical Property of Silicon Wafer

Chemical Cleaning Technology of Silicon Wafer

Study on the Deposition of Copper onto Silicon Wafer Surface in HF Solution

Chemic-mechanical Polishing of Silicon Wafer

Progress of multi - wire saw for precision slicing of silicon wafer

Silicon wafer surface passivation for solar cell

Study on Processing Technique of Silicon Wafer Back Surface of for External Gettering

Study on the Micro-Kinetics of Silicon Wafer Direct Bonding

Study on Ultra-Precision Polishing of Silicon Wafer by Nanosized Abrasives

Mono-crystal silicon wafer polishing workshop of Lili Electronics Inc. Of NFTZ

Electronic Structure of Surface of Cleaned Silicon Wafer