| 单词 | stencil buffer | ||||||||||
| 释义 | stencil buffer
更多释义 收起释义 例句释义: 模板缓存,模板缓冲区,模版缓冲 1. Another way is to use the stencil buffer in a multipass algorithm to control what parts of the scene are updated by a projected texture. 另外一个办法是在多遍渲染中使用模板缓存的算法来控制场景中那些部分将被投影纹理更新。 dictsearch.appspot.com 2. Specifies whether the stencil buffer entry can be incremented , wrapping to zero if the new value exceeds the maximum value . 指定是否可以增加模具缓冲区项，如果新值超过最大值，则转换为零。 www.bing.com 3. Specifies whether the stencil buffer entry can be incremented, clamping to the maximum value . 指定是否可以增加模具缓冲区项，模具缓冲区项的值不得超过最大值。 www.bing.com 4. Similarly, the method fails if the Stencil flag is specified when the depth-buffer format does not contain stencil buffer information. 同样，如果在深度缓冲区格式不包含模具缓冲区信息时指定Stencil标志，该方法也会失败。 msdn2.microsoft.com 5. Specifies whether to replace the stencil buffer entry with a reference value. 指定是否可以使用引用值替换模具缓冲区项。 msdn2.microsoft.com 6. Specifies whether the stencil buffer entry can be decremented, clamping to zero. 指定是否可以减少模具缓冲区项，最小值为零。 msdn2.microsoft.com 7. Retrieves or sets the write mask applied to values written into the stencil buffer. 检索或设置写掩码，应用该掩码写入模具缓冲区的值。 msdn2.microsoft.com 8. Decrements the stencil buffer entry, wrapping to the maximum value if the new value is less than 0. 递减模具缓冲区项，如果新值小于0，则环回到最大值。 msdn2.microsoft.com 9. Specifies whether the device supports setting the stencil buffer entry to zero. 指定设备是否支持将模具缓冲区项设为零。 msdn2.microsoft.com 10. Some hardware tests the compatibility of the depth stencil buffer with the color buffer. 某些硬件可测试深度模具缓冲区与颜色缓冲区的兼容性。 msdn2.microsoft.com 1. Flag is specified when the depth-buffer format does not contain stencil buffer information. 同样，如果在深度缓冲区格式不包含模具缓冲区信息时指定。 msdn2.microsoft.com 2. Replaces the stencil buffer entry with a reference value. 用引用值替换模具缓冲区项。 msdn2.microsoft.com 3. Contains flags that specify supported stencil buffer operations. 包含指定受支持的模具缓冲区操作的标志。 msdn2.microsoft.com 4. Gets the supported stencil buffer comparison operations. 获取受支持的模具缓冲区比较操作。 msdn2.microsoft.com 5. That indicates the supported stencil-buffer operations. 指示受支持的模具缓冲区操作。 msdn2.microsoft.com 6. Increments the stencil buffer entry, clamping to the maximum value. 递增模具缓冲区项，固定到最大值。 msdn2.microsoft.com 7. Gets the supported stencil buffer operations. 获取受支持的模具缓冲区操作。 msdn2.microsoft.com 8. Does not update the stencil buffer entry. 不更新模具缓冲区项。 msdn2.microsoft.com 9. Stencil: Clears the stencil buffer to the value in the stencil parameter. Stencil：将模具缓冲区清除为stencil参数中的值。 msdn2.microsoft.com 10. The device does not have a depth stencil buffer associated with it. 设备没有与之相关联的深度模具缓冲区。 msdn2.microsoft.com 1. Increments the stencil buffer entry, wrapping to 0 if the new value exceeds the maximum value. 递增模具缓冲区项，如果新值超出最大值，则环回到0。 msdn2.microsoft.com 2. Is the bit depth of the stencil buffer. 是模具缓冲区的位深度。 msdn2.microsoft.com 3. Inverts the bits in the stencil buffer entry. 反转模具缓冲区项中的各个位。 msdn2.microsoft.com 4. Sets the stencil buffer entry to 0. 将模具缓冲区项设置为0。 msdn2.microsoft.com 5. Direct3D Mobile Stencil Buffer Stencil Depth Sample Direct3DMobile模具缓冲区模具深度示例 msdn2.microsoft.com 6. Dynamic shadows using the stencil buffer 基于模板缓存的动态阴影 tiki.ss.pku.edu.cn |
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