| 单词 | semiconductor chips | ||||||
| 释义 | semiconductor chips
例句释义: 半导体芯片,半导体集成电路芯片,半导体晶片 1. At the implementation level, we view the computer system as a collection of wires, cables, semiconductor chips and discrete components. 在执行标准方面，我们认为电脑系统就是一套电线，电缆，半导体晶片零散的零件的组合。 iask.sina.com.cn 2. In one case, Infinity invested in a Chinese firm and helped it acquire technology for packaging semiconductor chips. 这里讲一个案例。英飞尼迪投资了一家中国公司，并帮它收购了一种半导体芯片包装技术。 chinese.wsj.com 3. These crystals are the basis of the semiconductor chips which run modern computers. 现代计算机里使用的半导体芯片都少不了这种结晶体。 www.kuenglish.info 4. London: world sand prices skyrocket after North Korea announces plans to mass produce giant semiconductor chips. 伦敦：在朝鲜宣布大规模生产巨型半导体晶片之后，全球黄沙价格一路飙升。 www.ftchinese.com 5. The company is specialized in the development and applications of RF semiconductor chips. 公司的核心技术集中在射频芯片的开发及应用方面。 word.hcbus.com 6. To provide an adhesive resin with high reliability for semiconductor chips. 本发明提供可靠性高的半导体晶片连接用树脂。 ip.com 7. He was responsible for the design and development of ESD circuits for advanced microprocessors and other semiconductor chips. 他负责研发用于先进微处理器与半导体晶片中的ESD电路。 dictsearch.appspot.com 8. Samsung is the world's No. 1 producer of semiconductor chips by value and LCD-panel TVs by volume. 按产值计算，三星电子是全球最大的半导体芯片生产商，按产量计算，它是全球最大的液晶电视生产商。 www.bing.com 9. The semiconductor device includes: an inner insert apparatus (166) used for lapping and loading the semiconductor chips; 该半导体装置具有：用于层叠并载置多个半导体芯片的内插器（166）； ip.com 10. A carrier plate provided with at least one opening is provided so as to connect and arrange the semiconductor chips in the opening; 提供一具有至少一开口的承载板以将该半导体芯片连接安置于该开口中； ip.com 1. Ultra-violet Fluorescence Nondestructive Detective on Semiconductor Chips 半导体芯片紫外荧光无损检测 service.ilib.cn 2. LCD screens and semiconductor chips share the same materials and manufacturing processes as solar photo-voltaic cells; 液晶显示器、半导体芯片与太阳能光伏电池是使用相同的材料和制造工艺技术。 bbs.ecocn.org 3. Adhesion of low-temperature sintered silver paste applied for semiconductor chips assembly 低温烧结型银浆料在半导体芯片组装时的附着力 www.ilib.cn 4. Growth Technology of Ag Boss Microelectrode on Semiconductor Chips 半导体芯片银凸点微电极生长技术 ilib.cn |
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