| 单词 | printed board |
| 释义 | 例句释义: 印刷电路板,印制板,印制电路板,印刷板 1. The utility model is composed of a double-hole panel, screws and a printed board with elements, and a second distributer circuit is adopted. 本实用新型是由双孔面板、带元件的印制板和螺钉构成，采用的是二分配器电路。 ip.com 2. Printed board assemblies - Part 4 : sectional specification - Requirements for terminal soldered assemblies. 印刷电路板组件.第4部分：分规范.端点焊接组件的要求 www.mapeng.net 3. Printed board assemblies - Part 2 : sectional specification - Requirements for surface mount soldered assemblies. 印刷电路板组件.第2部分：分规范.表面安装焊接组件的要求 www.mapeng.net 4. Printed board assemblies - Part 3 : sectional specification - Requirements for through-hole mount soldered assemblies. 印刷电路板组件.第3部分：分规范.通孔安装焊接组件的要求 www.mapeng.net 5. ELECTRONIC COMPONENTS. TWO PART AND EDGE SOCKET. CONNECTORS FOR PRINTED BOARD APPLICATION. 电子件.印制电路板的两部件连接和插入连接 www.mapeng.net 6. Quality assessment systems - Part 1 : registration and analysis of defects on printed board assemblies. 质量评定体系.第1部分：印制板装配件的缺陷注册和分析 www.mapeng.net 7. Guided by Repair Engineer to analyze root cause of failed PBA (Printed Board Assembly). 在维修工程师的带领下发现下线板的根本原因。 www.121job.cn 8. Cutting of printed board lead wire welding tip of electrical industry. 用于电子行业印刷电路板引线焊接头的切割。 www.chinahtp.com 9. Printed boards and printed board assemblies - Design and use - Part 1-2 : generic requirements - Controlled impedance. 印制板和印制板组件.设计和使用.第1-2部分：一般要求.受控阻抗 www.mapeng.net 10. Detail specification : two-part connectors for printed board for high number of contacts with basic grid of 2, 54 mm on 3 or 4 rows. 详细规范：带有3或4行上2.54mm基本格栅的高数值触点印制电路板用两件式连接器 www.mapeng.net 1. A post-treatment technics on electrolytic copper foil used for printed board 印制板用电解铜箔后处理工艺的研究 www.ilib.cn 2. Printed board assemblies - Sectional specification - Requirements for terminal soldered assemblies 印刷电路板组件.分规范.端点焊接组件的要求 www.mapeng.net 3. Printed board assemblies - Sectional specification - Requirements for surface mount soldered assemblies 印刷电路板组件.分规范.表面安装焊接组件的要求 www.mapeng.net 4. Printed board assemblies - Sectional specification - Requirements for through-hole mount soldered assemblies 印刷电路板组件.分规范.通孔安装焊接组件的要求 www.mapeng.net 5. Blank detail specification: Printed board assembly modular electronic units of assessed quality - Capability approval 空白详细规范：经质量评定的印制板组件模块电子器件能力批准 www.mapeng.net 6. Harmonized system of quality assessment for electronic components - Process assessment schedule: printed board assembly facilities 电子器件质量评定协调体系.过程评估附表：印制电路板组装设备 www.mapeng.net 7. Sectional Requirements for Implementation of Printed Board Manufacturing Data Description 实施印制板制造数据描述的分要求 bz.qs100.com 8. Optimum of Technology Parameters about Lamination of Flexible Multilayer Printed Board with Orthogonal Experiment 用正交试验法优化挠性多层板层压工艺参数 www.ilib.cn 9. Information Requirements for Manufacturing Printed Board Assemblies 生产印制电路板组件的信息要求 www.isres.com 10. Printed Board Process, Capability, Quality and Relative Reliability Benchmark Test Standard and Database 印制板工艺，容量，质量，可靠性试验标准和数据库 tech.sosemi.net 1. Rules for the preparation of detail specifications for printed board programming switches 印制电路板程序开关详细规范的制定规则 www.mapeng.net 2. Quality assessment systems - Registration and analysis of defects on printed board assemblies 质量评定体系.印制板装配件的缺陷注册和分析 www.mapeng.net 3. Printed wiring boards - Guide to the rework and repair of soldered surface mounted printed board assemblies 印制电路板.钎焊表面安装印制板组件的检修和再加工指南 www.mapeng.net 4. Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies 高可靠表面安装印制板组装件技术设计导则 bz.qs100.com 5. Qualification and Performance of Polymer Thick Film Printed Boards for Printed Board Manufacture and 聚合物厚膜印制板的鉴定与性能 wenku.baidu.com 6. Sectional specification: Two part and edge socket connectors for printed board application 分规范：印制板用两件式侧边插座连接器 www.std168.com 7. Study on Operation Characteristics of the Single Printed Board Current Sensor 一种印制板罗氏线圈的结构参数和电磁参数影响研究 www.ilib.cn 8. Detail specification for multi-contact two-part printed board electrical connectors 多触点两件式印制电路板连接器的详细规范 www.mapeng.net 9. Troubleshooting for Printed Board Manufacture and Assembly 印制板制造和组装的故障排除 bz.qs100.com 10. Troubleshooting Guide for Printed Board Manufacture and Assembly 印制板制造及组装故障修理指南 info.pcbtn.com 1. General Specification for Rigid Printed Board Backplanes with Press-Fit Contacts 带压接连接器的刚性印制背板通用技术规范 www.auto-alt.cn 2. Process assessment schedule for printed board design facilities 印制电路板设计设备的加工评定一览表 www.mapeng.net 3. Research on Transmission Characteristic of Printed Board Trace 印制线的传输特性研究 service.ilib.cn 4. Acceptability of Printed Board Assemblies 印制板组件的合格条件 www.isres.com 5. Backplanes with Press-Fit Contacts, Rigid Printed Board 带有压配合触点的硬印制底板 www.mapeng.net 6. Soft soldering - Part 5: Registration and analysis of defects on printed board assemblies 软焊接第5部分：印制电路板组件缺陷的登记和分析 www.mapeng.net 7. Standards for Printed Board Materials Manual 印制板材料标准手册 z.tougao98.com 8. Lamination Process of Multilayer Printed Board 多层板压合制程 www.ilib.cn 9. Standards for Printed Board Assembly Manual 种常用印制板组装标准合订本 www.smtsite.com 10. Design Guide for Press Fit Rigid Printed Board Backplanes 刚性压接印制背板设计指南 www.auto-alt.cn 1. rigid printed board flexible printed board 刚性印制板挠性印制板 wenku.baidu.com 2. Cause of Multilayer Printed Board's Warp and the Countermeasure 多层印制电路板翘曲成因与对策 www.ilib.cn 3. Generic Standard on Printed Board Design 印制板设计通用标准 bz.qs100.com 4. Design Guide for Press Fit Rigid Printed Board Back Plane 压配合刚性印制背板设计指南 bz.qs100.com 5. SMPB Sequential Multilayer Printed Board 多层印制板 www.51smt.net |
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