| 单词 | lead frame | ||||||||||||
| 释义 | lead frame
更多释义 收起释义 例句释义: 引线框架,导线架,引脚框架 1. The low-profile TLMx100x LED package consists of a reliable lead frame base embedded in a clear epoxy. 超薄TLMx100x封装包含嵌入在清晰环氧树脂中的可靠引线框基盘。 www.vishay.com 2. The part is available in a 32-lead lead frame chip scale package (LFCSP), and a 25-ball wafer level chip scale package (WLCSP). 该器件提供两种封装：32引脚架构芯片级封装（LFCSP）和25引脚晶圆级芯片规模封装（WLCSP）。 www.bdtic.com 3. The invention provides a lead frame and packaging of a semiconductor device. 本发明提供一种半导体器件的引线框及封装。 ip.com 4. C194 copper alloy is one of the representative materials of lead frame . C194铜合金是最具代表性的引线框架材料之一。 www.showxiu.com 5. Do not put any stress to the lead frame when it is heated in soldering. 焊接时在引线架被加热的状态下请不要施加压力。 wenku.baidu.com 6. This results that the lead frame and the detection element have improved electrical connection. 这导致引线框架和检测元件之间的具有改善的电连接状态。 ip.com 7. This article presents briefly the mam lead-Frame Materials used abroad and the developments in recent years. 本文简单介绍了国外使用的主要引线框架材料及其近年来的新开发。 dictsearch.appspot.com 8. IC industries produces thousand tons of scrap IC lead frame every year, which contains Sn, Fe, Ni metals. IC导线边框是冲压机冲出IC导线脚架所剩的废料，含有锡铁镍等元素。 www.dictall.com 9. The package is available in a lead (Pb) free version, with 100% matte tin lead frame plating. 该封装采用无铅（Pb）免费版本，与100%雾锡电镀引脚框。 forum.esm-cn.com 10. A number of fingers are attached to the lead frame, and one or more electrode contact surfaces are attached to each finger. 多个指状物，每个指状物具有第一端和第二端，每个指状物的第一端附着到所述引线框架； ip.com 1. electrically connecting pads on the surface of the chip with a base pin of the lead frame; 将芯片表面的焊盘与引线框架的管脚电学连接； ip.com 2. adhering a chip base and a lead frame which are used for encapsulating a chip to the viscous surface of the film; 将用于封装芯片的芯片基座和引线框架粘附在所述薄膜的粘性表面； ip.com 3. Application Requirements for lead frame Used for IC Plastic encapsulation 集成电路塑封中引线框架使用要求 service.ilib.cn 4. Technology investigation of KFC copper alloy used for lead frame KFC引线框架铜合金带材的生产工艺研究 www.ilib.cn 5. A laser apparatus comprises: a lead frame comprising a first outer lead and a first inner lead connected to the first outer lead; 一种激光装置，其特征在于，具备：引线框，其具有：第一外部引线，和与所述第一外部引线连接的第一内部引线； ip.com 6. Design example of high speed stamping die for metal parts of an apparatus apply lead frame of ic ic框架类元器件高速冲压模具设计实例 www.duanxie.cn 7. Progress of Study on Lead Frame Copper Alloy and Its Implementation in Electronic Industry 电子工业用引线框架铜合金及组织的研究 www.ilib.cn 8. Application and Commercialization of Copper Alloy Lead Frame Materials for Integrated Circuits 集成电路用铜合金引线框架材料的应用及产业化 www.ilib.cn 9. Application of continuous high speed plating technology in IC lead frame production 连续高速电镀技术在集成电路引线框架生产中的应用 service.ilib.cn 10. performing injection molding on the chip base and the lead frame by using a first injection mould and insulation adhesive; 采用第一注塑模具和绝缘胶对所述芯片基座和引线框架实施注塑； ip.com 1. An Investigation on Additives for Lead Frame in High Speed Electroplating for Tin- lead Alloy 引线框架高速锡铅电镀添加剂的研究 service.ilib.cn 2. Designing and Manufacturing of Integrated Circuit Lead Frame 集成电路引线框架设计制造 shop.80088.cn 3. The Research Status and Trends of Lead Frame Materials for Integrated Circuits 集成电路用引线框架材料的研究现状与趋势 service.ilib.cn 4. Numerical analysis of surface flaking in finish rolled lead frame copper alloy 引线框架铜合金精轧薄板表面起皮剥落的数值分析 www.ilib.cn 5. Study of strip layout in progressive die CAD for IC lead frame based on optimizing rules 基于优化准则的IC引线框架级进模工序设计 ilib.cn 6. Oxidation Failure and Mechanism of Lead Frame Copper Alloys for IC Package IC铜合金引线框架材料的氧化失效及其机理 www.ilib.cn 7. Microstructure and Capability Research of KFC Lead Frame KFC引线框架材料组织性能研究 service.ilib.cn 8. lead bonding lead frame bonding tape automated bonding, TAB 引线框式键合带式自动键合激光键合 wenku.baidu.com 9. Researches and Production Development of Copper Alloy Materials for Lead Frame 引线框架铜合金材料研究及开发进展 service.ilib.cn 10. Thermal Analysis of Integrated Circuit Lead-Frame 集成电路引线框架的热性能分析 www.ilib.cn 1. Design of the Progressive Die for the Lead Frame 引线框架级进模设计 ilib.cn 2. Study on Process and Properties of KFC Copper Alloy Strip for Lead Frame 引线框架用KFC铜合金带材加工工艺及性能研究 www.ilib.cn 3. Summarization on the Materials for IC Lead Frame IC引线框架材料概述 service.ilib.cn 4. Effect of Sheet Thickness on Surface Peeling in Cu-Fe-P Lead Frame Alloy 板材厚度对铜合金冷轧薄板表面起皮的影响 www.ilib.cn 5. The Effect of Lead Frame Material on Interface Microstructure between Copper Alloy and SnPb Solder 引线框架材料对铜合金与锡铅焊料界面组织的影响 www.ilib.cn 6. The status and development of oxidation of copper alloy for lead frame 引线框架铜合金氧化特性的研究现状 service.ilib.cn 7. Study on Some Cu-RE Alloys for New Lead-frame Materials 新型铜-稀土系引线框架材料研制 www.ilib.cn 8. The Status and Development of Lead Frame Material of Copper Alloy 铜合金引线框架材料现状与发展 www.ilib.cn 9. Research and Development of Copper Alloys for Lead Frame 引线框架用铜合金的研究与发展 www.ilib.cn 10. Multistage Die Design for IC Lead Frame 工位IC引线框架级进模设计 ilib.cn 1. Trends and Development of Materials for Lead Frame 引线框架材料的研究发展现状 www.ilib.cn 2. The Status and Development of Copper Alloys for Lead Frame 铜合金引线框架材料的研究现状与发展 www.ilib.cn 3. Trends and development of copper alloys for lead frame 铜基引线框架材料的研究与发展 service.ilib.cn 4. High Frequency IC Package Design Based on QFP Lead Frame 基于QFP技术的高频集成电路封装设计 www.ilib.cn 5. How to Select Measuring Ways of Lead Frame Plating Layer 引线框架电镀层测定方法的选择 service.ilib.cn 6. dual in line lead frame 双列直插式引线框架 www.bing.com |
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