The important factors influencing the gaps closing include the gap height, the spatial wavelength, the specific surface energyofadhesion, the material deformability and the silicon wafer thickness.
To obtain optimum adhesion, it is necessary to increase the surface energyof the substrate to just above that of the material to be applied.
为了获得最佳的附着力,有必要增加基板表面能量略高于材料的适用。
3
The results show that the interfacial adhesion strength increased noticeably for composites of active aramid fiber but the fracture energy of the interface decreased.