Low cost test forintegratedcircuits or electrical modules using a reconfigurable logic device is described.
描述了使用可重新配置逻辑器件对集成电路或电模块的低成本测试。
2
We propose a novel thermal-conscious power model forintegratedcircuits that can accurately predict power and temperature under voltage scaling.
提出了一种新型热感功耗模型,该模型能够准确估计出电压调整情况下的功耗和温度。
3
Used for iron pentacarbonyl encapsulated compound and chemical catalysts, and it's the idea raw material of semitransparent photoetching films forintegratedcircuits.