Furthermore, stressstrain distribution in the solder joints has dynamic feature during temperature cycling and is related to temperature history.
在温度历史过程中，应力—应变场等值分布图呈现动态特性，且与温度历史相关。
2
The dynamicstress-strainand welding residual stress during welding are the significant factors which lead to welded cracking and debasement of the joint properties.
在焊接过程中产生的动态应力应变及随后形成的残余应力，是导致焊接裂纹和接头性能下降的重要因素。
3
Because it is hard to obtain dynamicstress equilibrium and constant strain rate in soft materials specimen during the conventional SHPB experiments, a pulse shaping technique is developed.