Along with the increase of package density, the issue of ASIC thermal failure has become more and more important.
随着封装密度的进一步提高，其热失效问题也变得更加严重。
2
Moreover, based on the method of finite element analysis and the general software, the failure behavior of high density syntactic foams is investigated.
还利用计算机和通用软件对高密度复合泡沫塑料进行了有限元分析，研究了高密度复合泡沫塑料的失效行为。
3
The implications of this failure to attain sufficient bone density during the formative years are frightening.