Double sided polishing process has become a main machining method for silicon wafer finishing process, but it is difficult to get ultra-smooth surface with the very stringent machining conditions.
双面抛光已成为硅晶片的主要后续加工方法，但由于需要严格的加工条件，很难获得理想的超光滑表面。
2
Solder alloys are selected for their properties to flow, sealing ability, electrical conductivity, and for general body work to provide a smooth surface for finishing.
选择软焊合金时应考虑其流动性、密封能力和导电性，此外？以提供光滑的加工表面。
3
Except mechanical softening finishing, softening agent is also used to finish nonwovens in finishing process in order to make nonwovens have mellow and smooth feeling.