By means of technique of X-ray double crystal diffraction, the different cutting damages of silicon slices have been studied.
作者利用双晶X射线衍射技术,研究了不同切割速率下硅晶片的切割损伤。
2
Some double crystal rocking curves of photocathode epitaxy materials and substrates are measured by means of X-ray double crystal diffraction in the bonding process.
用X射线双晶衍射仪测量了阴极和玻璃热粘结工艺过程中阴极材料外延层和衬底的双晶回摆曲线。
3
Double slit diffraction is the double slit interference phenomenon modulated by single slit diffraction.