It proves that the designed parallel bonding mechanism meets the working requirements of IC Chip Die by these characteristic curves.
根据这些曲线，说明所设计的并联焊头机构能满足IC芯片粘片机的工作要求。
2
How many of us in the parallel vast universe are there? How many times live and die? How many silent reincarnations?
在这浩瀚的宇宙之中，有多少个平行的我们？有多少场生死覆灭？又有多少静默的轮回？
3
The experimental results indicate that the designed parallel mechanism can meet the working requirements of the IC die bonder and each performance index has reached the design standards.