Thermal mismatch induced by the diebonding structure greatly affects the reliability and performance of MEMS devices.
芯片粘接工艺引起的器件-封装热失配会对MEMS器件的可靠性和性能产生显著影响。
2
The diebonding requires the temperature field of the oven to be even, but an existing curing oven can not suit the requirement.
半导体封装粘结工艺养护过程要求炉内温度均匀分布，现有养护炉不能满足这一要求。
3
The thermal resister of power LED is analyzed in this paper. Using the silver paste and epoxy resin as diebonding materials, two kinds of power LEDs are made.