This paper introduced a new coppertreatment agent ST-10+ for improving the adhesion of dry film to printed circuit board copper substrate.
本文介绍了一种能提高干膜与线路板铜基粘合力的新型铜面处理剂ST-10+。
2
As the electroplating pure copper layer on copper alloy exceeds a critical thickness, the surface electroplating treatment can improve the copper alloy's resistance against oxidation failure greatly.
当铜合金表面的电镀纯铜层厚度超过一个临界值,表面电镀纯铜处理可以明显改善材料的耐氧化剥离性。
3
The stainless tubing is less likely to kink than copper, but it is harder to solder without an acid treatment.