The research keystones of copperelectroless plating were presented.
提出了化学镀铜今后的研究重点。
2
Copper and plastic coefficient of expansion, and, therefore, more close to the plastic used in electroplating electrolesscopper plating coating layer as conductive.
金属铜与塑料的膨胀系数比较接近,因此,在塑料电镀中常用化学镀铜层作为电镀的导电镀层。
3
Is there an active continuous improvement team for plating voids in the electrolesscopper operation?