Copper and plastic coefficient of expansion, and, therefore, more close to the plastic used in electroplating electrolesscopper plating coating layer as conductive.
金属铜与塑料的膨胀系数比较接近，因此，在塑料电镀中常用化学镀铜层作为电镀的导电镀层。
2
Is there an active continuous improvement team for plating voids in the electrolesscopper operation?
化学沉铜是否对电镀空洞有积极的持续改善小组？
3
Electrolesscopper depositing processess are controlled by the kinetics of formaldehyde oxidation reaction, which donate electron for the cathodic reduction of cupric ions.